芯片封装基本类型

DIP (Dual Inline Pckage) --- 双列直插式封装
DIMM (Dual Inline Memory Module) --- 双列直插存贮型组件
Can (Metal Can Package) --- 金属壳封装
BeamChip --- 梁式芯片
Beaml (BeamLead Package) --- 梁式引线封装
Zip tab (Zig Zag Inline with MetalHealHeatsink) --- 带散热片的Z形引线单列直插式
DIPtab (DIPackage with Meatlheatsink) --- 带散热片的双列直插封装
DPAK ()
FP (Flat Package) --- 扁平封装
FPL (Flat Package "L" Leads) --- L引线扁平封装
PLCC (Plastic Leaded Chip Carrier) --- 引线片装
RFMOD (Radio Frequency Module) --- 无线电频率组件
SIP (Single Inline Package) --- 单列直插式封装
SIPtab (SIP with Metal Heatsink) --- 带散热片的单列直插式封装
SOP (Small Outline DIP) --- 短输出双列贴片封装
ZIP (Zip Zag Inline Package) --- Z形引线单列直插式封装
LCC (Leadless Chip Carrier) --- 无引线片载
Module (Modular Package) --- 组合式封装
QFP(F) (Flat Package Quad stgle) --- 四向扁平封装
QUIP (Quad Inline Package) --- 四列直插式封装
QUIPtab (QUIP with Metal Heatsink) --- 带散热片的四列直插封装