Aug. 6 - 7, 2020, Dali City, China
http://blocksys.info/
Overview
BlockSys’2020 is a research conference on the theory and practice of blockchain and trustworthy systems. Blockchain has become a hot research area in academia and industry. The blockchain technology is transforming industries by enabling anonymous and trustful transactions in decentralized and trustless environments. As a result, blockchain technology and other technologies for developing trustworthy systems can be used to reduce system risks, mitigate financial fraud and cut down operational cost. Blockchain and trustworthy systems can be applied to many fields, such as financial services, social management and supply chain management.
Research Track
This conference provides scientists and engineers from both industry and academia a platform to present their ongoing work, relate their research outcomes and experiences, and discuss the best and most efficient techniques for the development of blockchain and trustworthy systems. Topics of the conference include, but are not limited to:
Theories and algorithms for Blockchain
Platform development for Blockchain
Performance Optimization of Blockchain
Smart contracts for Blockchain
Security, privacy and trust for Blockchain
Blockchain and social management
Blockchain and big data
Blockchain and service computing
Blockchain and cloud computing
Blockchain and Internet of Things
Blockchain based applications
Scalability and fault tolerance mechanisms for trustworthy systems
Algorithms, architecture, framework, design patterns and techniques for trustworthy systems
Scalability and fault tolerance mechanisms for trustworthy systems
Security, privacy, safety, and riskmanagement for trustworthy systems
Metrics and measurement for trustworthy systems
Quality assurance, maintenance and reverse engineering for trustworthy systems
Verification, validation, testing, and analysis for trustworthy systems
Communication, networking, optimization, and performance for trustworthy systems
Empirical studies, benchmarking, and industrial best practices for trustworthy systems
Trustworthy System Development
Other emerging ideas and solutions for blockchain and trustworthy systems
Manuscript Guidelines and Submission Information
Papers must be clearly presented in English, must not exceed 14 pages(one-column format, appropriately 6-7 pages in IEEE standard double-column format) in Springer LNCS format.
Please submit your paper(s) in PDF file at the submission site:https://easychair.org/conferences/?conf=blocksys2020
Publications
All accepted and presented papers will be published by Springer in the Communications in Computer and Information Science (CCIS) series, and will be indexed by EI Compendex. Distinguished papers (more than 30 papers) presented at the conference, after further revision, will be published in special issues of selected journals.
IEEE Transactions on Industrial Informatics (SCI, IF=7.377, pending)
IEEE Transactions on Vehicular Technology (SCI, IF=5.339, pending)
IEEE Internet of Things Journal (SCI, IF=9.515, pending)
International Journal of Computational Science and Engineering (ESCI, EI)
International Journal of Embedded Systems (ESCI, EI)
Important Dates
Paper submission due: Apr. 01, 2020
Notification to authors on the decisions on papers: May. 15, 2020
Camera-ready papers due: Jun. 01, 2020
Conference date: Aug. 06 - 07, 2020
Organizing Committee
Honorary Chairs:
Huaimin Wang, National University of Defense Technology
Jiannong Cao, The Hong Kong Polytechnic University
General Chairs:
Zibin Zheng, Sun Yat-sen University
Yan Zhang, University of Oslo
Benhui Chen, Dali University
Program Chairs:
Hong-Ning Dai, Macau University of Science and Technology
Shangguang Wang, Beijing University of Posts and Telecommunications
Xiaodong Fu, Kunming University of Science and Technology
Organizing Chairs:
Haichao Yang, Dali University
Yong Feng, Kunming University of Science and Technology
Jiajing Wu, Sun Yat-sen University
Zhenpeng Li, Dali University
Publicity Chairs:
Wei Liang, Hunan University
Yongjuan Wang, Information Engineering University
Celimuge Wu, The University of Electro-Communications
Kun Wang, University of California, Los Angeles
Wei Feng, Tsinghua University
Publication Chairs:
Li Liu, Kunming University of Science and Technology
Xiangping Chen, Sun Yat-sen University
Ke Zhang, University of Electronic Science and Technology of China
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