System in Package (SIP)

A System in Package integrates a number of ICs into a highly compact package that functions as a unit. There is a huge trend in microelectronics towards System in Package, heterogeneous integration. HiRel / Space is highly concerned, as low and medium volumes prohibit the development of System on Chip (SoC).
SiP is a concept, not a package type or a technology with infinite potential configurations!

Teledyne e2v brings its knowledge and heritage in producing components and systems for high-end markets to meet customers’ expectations for highly integrated devices.

If you wish to learn more about our SiP capabilities, please download our latest white paper:
Making History: Advanced System in a Package Technologies Enable Direct RF Conversion

Strengths of SiP:

Heterogeneous integration, ie. the use of dies from different technologies and / or manufacturer, which permits the selection of the optimum technology for each function
Quick development through parallel development of each function
Product versatility, because a new product can easily be developed by changing one function, without total re-development
Much better SWaP (Size, Weight and Power) factor than solutions built from discrete devices
Faster time to market
Better economical fit with market nature (low volume)

SiP Capabilities at Teledyne e2v:

Electronics design
Package design
Test engineering
Thermal and signal, integrity simulations
Manufacturing
Life cycle management / long term support

MCM Heritage at Teledyne e2v

Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.

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