SMT代工厂的审核要求
Paste Printing
Paste Printing（锡膏印刷）
1. Work Instructions （作业指导书）
1 Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
是否有对产品的特别细节详细描述的且有版本控制的作业指导书？
2 Are Work Instructions readily available to the operator and are they followed at Paste Print?
作业指导书是否适用于操作者并得到实施？
3 Is the Solder Paste specified in the Paste Printing program or on Work Instructions?
在印刷程序或作业指导书是否有指明使用的锡膏？
4 Is the Solder Paste manufacturer, number, & mesh defined in the Paste Print Program or on Work Instructions?
是否在印刷程序或作业指导书详细说明锡膏的制造商、编号(料号)及目数？
5 Is the Stencil's identification specified in the Paste Printing program or on Work Instructions?
在印刷程序或作业指导书是否详细说明钢网的标识？
6 Is the Stencil's identification traceable to a specific PWB part number, revision level and board side?
钢网的标识是否可追溯到PWB板的料号、版本及板面？
7 Is the Stencil loading orientation specified on the Stencil or on Work Instructions?
在作业指导书或钢网上是否指明了放置方向？
8 Is the Squeegee in use specified in the Paste Print program or Work Instructions?
在印刷程序或作业指导书是否详细说明所使用的刮刀？
9 Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions?
作业指导书是否指明支撑块/销的数量、位置、型号及高度？
10 Are all hand tools needed by the operator listed with their descriptions on Work Instructions?
作业指导书是否列出并详细描述操作者需要使用到的工具？
11 Has the use of metal tools for the application and/or removal of paste been specifically disallowed?
是否明确指明在施加或移除锡膏不可使用金属工具？
12 Is the PWB part number and Revision specified on the Work Instruction or line set-up instructions?
在作业指导书或生产线设定指导书是否详细说明PWB的料号、版本？
13 Is the PWB orientation to the Stencil identified in the Work Instructions or line set-up instructions?
在作业指导书或生产线设定指导书是否详细说明PWB对应钢网的方向？
14 Is the machine Program Name specified on the Work Instruction or line set-up instructions?
在作业指导书或生产线设定指导书是否指明了机器的程序名？
2. Solder Paste（锡膏）
1 Is there a Standard Operating Procedure for the cold storage of solder paste?
是否有标准的锡膏冷藏作业指导书？
2 Is the cold storage temperature within the manufacturers' recommended range for all solder paste in cold storage?
锡膏的冷藏温度是否在制造商推荐的范围内？
3 Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred.
锡膏的冷藏是否按先进先出控制？推荐使用重力自流进料架？
4 Does the cold storage unit have a temperature recorder, which can be read without opening the unit, to record temperature over time?
冷藏柜是否有温度记录，且不需打开就可随时记录温度？
5 Is there a documented requirement to periodically check that the recorded temperature is within the required storage limits?
是否有文件规定定期检查冷藏柜记录的温度在规定的贮存温度界限内？(文件要规定停电超过多少时间要视同回温作业）
6 Is there evidence to demonstrate that action was taken when the temperature was outside the defined storage limits?
是否有证据表明当温度超出规定贮存范围时采取了纠正措施？
7 Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container?
是否在锡膏容器上详细说明了产品的冷藏有效期？
8 Is the date and time that the Solder Paste has been removed from cold storage specified on its container?
是否在锡膏容器上详细标明了从冷藏柜取出的日期和时间？
9 Is the date and time that the Solder Paste is available for use, after removal from cold storage, specified on its container?
是否在锡膏容器上详细标明了从冷藏柜取出后可以开始使用的日期和时间？
10 Is the date and time that the Solder Paste expires at ambient temperature with its 'seal broken' documented and known?
对于在环境温度下开封的锡膏的超期日期和时间是否有文件规定和记录？
11 Is the date and time that the Solder Paste expires at ambient temperature with its 'seal in place' documented and known?
对于在环境温度下未开封的锡膏的超期日期和时间是否有文件规定和记录？
12 Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood by users?
是否有证据证明操作者正确完成这些信息并完全理解整个过程？
13 Are Screen Print Operators required to wear gloves when handling Solder Paste?
印刷操作者在处理锡膏时是否戴手套？
14 Is there a specification readily available for the Solder Paste?
是否有适用的锡膏规格书？
15 Is the mesh for the Solder Paste used suitable for the pitch technology on the board being built?
所使用的锡膏的目数是否符合即将印刷的板上引脚间距的技术要求？
16 Is the maximum time that the Solder Paste is allowed to remain on a board prior to reflow documented, known, & followed?
锡膏在回流前停留在板上的最大允许时间是否有文件规定，是否被理解并实施？
17 Is the Solder Paste lot code recorded and fully and easily traceable to the individual product serial number product?
锡膏的批号是否有记录并能够完整和容易地追踪到单个产品的系列号？
3. Stencil（钢网）
1 Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials?
所有钢网是否妥善保存以避免潜在损坏和避免外界及空气中的灰尘及杂质？
2 Are all Stencils identified with process proof labels or plates which are visible when the stencil is in its rack or mounted in the Printer?
当钢网在钢网架上或安装在印刷机上时，是否用可直接看到的过程校验标签或铭板区分？
3 Is the Stencil cleaned in a automatic stencil cleaner at the end of a production run or after a fixed time has elapsed?
在生产完成后或生产中定期清洗钢网时是否使用自动清洗设备？
4 Is there a documented requirement to inspect a Stencil for damage once cleaned?
是否有文件规定清洗后须检查钢网是否损坏？
5 Is the evidence of cleaning and inspection documented?
是否有清洗记录及检验记录？
6 Is there a documented Stencil Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used?
是否有文件规定钢网清洗过程中所用的清洗剂、清洗次数、干燥次数以及其他耗材？
7 Is there a documented Stencil Cleaner maintenance procedure which defines frequency for checking filters and solution levels?
是否有文件规定钢网清洗机维护保养程序中过滤器和清洗溶液液面的检查频率？
8 Is there evidence to demonstrate that the Stencil Cleaner's Maintenance procedure and records are adequate and up-to-date?
是否有证据证明钢网清洗机的维护保养程序和记录是足够和最新的？
9 Is there a documented requirement to periodically check the Stencil tension and is there evidence that this is done?
是否有文件要求定期检查钢网的张力并有证据表明已实施？
10 Is there a document which specifies Stencil ordering requirements with respect to size, thickness, ratio, orientation, identification, etc.?
是否有文件规定钢网订购时必需注意尺寸、厚度、开口比率、方向和标识？
11 Is there a document which specifies the conditions for when Laser vs. Chemical Etched vs. Electroformed Nickel, should be used?
是否有文件规定钢网的制作方式是激光切割、化学蚀刻或电铸镍？
12 Is there evidence to demonstrate that the Stencil ordering requirements are followed?
是否有证据表明钢网的订购要求得到实施？
13 Is there a documented Stencil First Article procedure which checks, tension, thickness, aperture sizes and design, first print, etc.?
钢网首检程序文件是否有列出检查张力、厚度、开口尺寸和设计，以及首次印刷质量等？
14 Is there evidence to demonstrate that the Stencil First Article procedure and records are adequate and up-to-date?
是否有证据证明钢网首检程序文件及记录是否足够和最新？
4. Squeegee（刮刀）
1 Are the Squeegees length, angle, style/durometer, defined to ensure correct Squeegee selection?
刮刀的长度、角度、类型/硬度是否详细说明以确保刮刀的正确选择？
2 Is there evidence to demonstrate that the Squeegee used is correct and is fully and easily traceable to the product and stencil?
是否有证据证明刮刀正确使用并可完整和容易地追溯到产品和钢网？
3 Are all Squeegees adequately stored in a manner to avoid potential damage?
所有的刮刀是否以适当的方式存放以防止潜在的损坏？
4 Is there evidence that Squeegees inspected for damage prior to use and prior to storage?
是否有证据证明刮刀使用前或保存前有检查是否损坏？
5 Is there a requirement to ensure the Squeegee is leveled either automatically or manually documented, prior to use?
是否有要求刮刀在使用前保持水平，不管是自动或人工？
5. Vacuum Blocks and Tooling（真空挡块和工具）
1 Is there a documented requirement to indicate that Blocks, Support Pins or Vacuum Blocks are needed for specific products?
是否有文件表明在具体的产品生产中定义所使用的支撑块、支撑销和真空挡块？
2 Are all Vacuum Blocks identified with a name or tooling number that is fully and easily traceable to the product and board side?
所有的真空挡块是否用名称或工具编号区分并可完整、容易地追溯到产品和板面？
3 Are all Vacuum Blocks clean and adequately stored in a manner to avoid potential damage?
所有的真空挡块是否清洁干净和用适当的方式贮存以避免潜在的损坏？
6. PCB
1 Are there satisfactory methods in place to control PCB handling and exposure?
是否有合适的方法来控制PCB的取放和暴露在空气中？
2 Does the PWB part number and Revision cross-reference to the PCBA part number and Revision?
PWB的料号和版本与PCBA的料号和版本是否相互对应？
3 Is a unique tracking label or PPID label placed on the PWB for tracking purposes at Paste Print? Score NA if Dell Assy Dwg does not require.
在锡膏印刷时PWB上是否贴有一特定的跟踪标签或PPID标签以便追溯？
4 Does the unique tracking label or PPID label date code specify the date the PWB was paste printed?
在特定的跟踪标签或PPID标签是否有日期代码详细说明PWB的锡膏印刷日期？
5 Are misprinted PWBs cleaned in an automatic board cleaner using appropriate fixturing?
所有印刷不良板是否用自动洗板机清洗且装在合适的夹具上？
6 Is there a documented Board Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used?
是否有文件规定板清洗过程中所用的清洗剂、清洗次数、干燥次数以及其他耗材？
7. Machine Capability（机器能力）
1 Is the Paste Printing technology suitable for the product being built?
锡膏印刷技术是否适用于目前生产的产品？
2 Is the Paste Printing operation automated with fiducial camera alignment?
锡膏印刷是否由基准相机校准且自动进行？
3 Is contact printing with stainless steel stencils and squeegees being used?
是否使用不锈钢网和不锈钢刮刀的接触式印刷？
4 Does the Printing machine have the capability to automatically wet and dry wipe the Stencil?
印刷机是否具备自动干擦和湿擦钢网的能力？
5 Does the Printing machine use the automatic wet and dry wipe capability?
印刷机是否使用自动干擦和湿擦钢网功能？
6 Does the Printing machine have Vacuum Stencil clean capability?
印刷机是否具备真空清洁钢网的能力？
7 Does the Printing machine use Vacuum Stencil clean?
印刷机是否使用真空清洁钢网的功能？
8 Is there a documented minimum frequency for stencil clean specified based on the technology used on the board?
基于板所使用到的技术，是否有文件规定最小的钢网清洁频率？
9 Are stencil wet and/or dry automatic clean rates specified for each product and shown in the program?
每种产品的自动湿擦和/或自动干擦钢网的比率是否规定在程序中？
10 Are all materials used to wipe the stencil specified as low lint or preferably lint free?
所有用于擦拭钢网的材料是否有规定是低尘或无尘？
11 Are changes to clean rates approved based only upon performance feedback?
对于清洁比率改变的核准是否仅仅基于印刷效果反馈？
12 Does the Printing machine have the capability to automatically dispense Solder Paste?
印刷机是否具备自动分配锡膏的能力？
13 Does the Printing machine use automatic Solder Paste dispense?
印刷机是否使用自动分配锡膏功能？
14 Does the Printing machine flag when the Solder Paste container is near empty?
锡膏快要用完时机器是否会报警？
15 Are all Printers enclosed in order to keep out foreign or airborne materials?
所有印刷机是否封闭以防止外界或空气中的灰尘和杂质？
16 Are localized climate control units installed and in use on all Paste Printers?
所有印刷机是否安装局部空调并且在使用？
17 Is the Printing machine programmable? If not score 0 for next 4 questions.
印刷机是否可编程？如果不可以，以下4个问题0分。
18 Is the machine Program Name revision controlled to show traceability of program changes?
机器程序名版本是否受控以显示程序变更的可追溯？
19 Is the machine Program Name traceable to the PCB and PCBA part number?
机器程序名是否可以跟踪到PCB料号和PCBA料号？
20 Is access to the machine program password protected with restricted access?
机器程序是否有密码保护以防止未授权进入？
21 Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer?
在机器控制过程中关键参数的不能随意变更，除非经过技术员/工程师同意？
8. Solder Paste
1 Is automatic 2D or 3D solder paste inspection deployed and effective? Review ICT or AOI/AXI results to determine effectiveness.
自动2D或3D锡膏检查是否有配置并实施？回顾AOI/AXI的结果验证检查效果。
2 Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false?
是否可以证明机器的不良提示有经过操作员的检查并判断正确真的是不良？
3 Is the 2D or 3D coverage % calculated based on the total # of pads with 2D or 3D vs the total # of apertures on the stencil?
2D或3D覆盖百分比是否从由2D/3D检查的所有焊盘与所有的钢网上的开口相比计算得来？
4 Does the exit conveyor from the API Equipment, stop to allow for verification of defects so that defective boards may be captured?
自动锡膏检查（API）设备出口传送机构是否能让不良板停止传送使得不良板被筛选出来？
5 Are rejected boards automatically stopped on this conveyer for operator false call validation?
判定不良的拒收板是否自动停在这个传送机构上以便操作者可以人工复判？
6 Are changes to 2D or 3D coverage made based only on performance feedback? Is this reflected in the Program Revision?
对于2D/3D覆盖率改变是否仅仅基于印刷效果反馈？是否反映在程序版本上？
7 Is there a document which defines the effect of changing critical Paste Printing parameters on the quality of the output?
是否有文件定义改变关键印刷参数对产品品质的影响？
9. PCBA
1 Are outputted boards at least sample inspected for print quality to ensure process control?
产出板是否至少检查样品的印刷质量以确保过程控制？
2 Is there a documented frequency for checking print quality?
是否有文件规定印刷质量检查频率？
3 Is there evidence to demonstrate that this print quality inspection is conducted?
是否有证据证明印刷质量检查有执行？
4 Is there a specification that defines acceptability of paste printing, available and used at the Paste Printer?
是否有规格书定义锡膏印刷的允收水准？是否可行并被执行？
Component Placement
Component Placement(贴片)
1. Work Instructions（作业指导书）
1 Is there a revision controlled Operator Work Instruction which contains loading information for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的作业指导书包括上料信息？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the operator and are they followed at Component Placement?
作业指导书是否适用于操作者并且被确实遵守？
3 Are component part numbers and descriptions included on the Work Instructions?
作业指导书上是否包含有元件料号和品名描述？
4 Are component descriptions sufficiently detailed to check at first-article that the correct components are being used?
首件检查之元件品名描述是否具体以确认元件使用是正确的?
5 Is the machine head/slot number for component loading specified for each part number on Work Instructions?
作业指导书是否指明每一料号的元件所对应的机器头/料槽号码？
6 Are the reference designators and the quantity per part number specified on Work Instructions?
作业指导书上是否指明每一料号的位号和倍率？
7 Is the component feeder type/size specified on Work Instructions or otherwise for each component package type?
作业指导书是否指明元件料枪型号/尺寸或者指明对应的每一种元件包装型号？
8 Is the machine Program Name specified on the Work Instruction or line set-up instructions?
作业指导书上或生产线设置说明书上是否指明机器程序名称？
2. Component Loading and Verification（元件上料和确认）
1 Is there an automated bar coded component loading verification aid in order to reduce the probability of incorrect loading? Note*
是否有自动的条码上料确认系统以减少上料错误？
2 Are the component loading verification aids hard linked to the placement program so that loading is verified against program data?
上料确认辅助系统是否和贴片程序硬件连接以依照程序数据再次确认上料之准确性？
3 Can traceability of component lot codes be demonstrated for critical devices?
对于关键元件是否可以追溯到元件批号？
4 Is component loading/changes verified and cross checked by an individual other than the set-up operator at product changeover? Note*
产品切换时元件上料/换料是否有另外一个独立的作业员进行确认而不仅仅是由上料的操作者自行检查？
5 Is a component loading/changes verification log signed by the set-up operator and countersigned by the cross checker before start up? Note*
在开始生产前，元件上料/换料表是否由上料作业员签字并且由另一名作业员检查且会签？
6 Is the correct feeder loading base used to facilitate real to feeder loading?
是否有正确的料枪上料对照表用于帮助料枪上料？
7 Are first-built boards verified against documentation for missing/misplaced components and for correct component polarity?
首件板是否根据文件（图纸或模板等）检查缺件/错件和元件极性？
8 Are first-articles conducted using AOI methods and complemented with description verification and value metering?
首件检查是否采用AOI方法辅以品名确认和数值量测？
9 Are all Resistors & Capacitors measured for a value within the tolerance (one per part number) at first-article & at reel change?
首件检查和更换料盘的时候是否对电阻和电容的数值和公差进行量测（一个料号量测一个）？
10 Is a first-article log signed to verify acceptance before start up?
在开动机器之前，首件确认是否有符合允收标准的签名？
11 Is the orientation of Tantalum SMT capacitors, Diodes, etc in tape format, standardized and documented for polarity orientation?
编带包装SMT钽电容，二极管等的极性方向是否有被标准化？文件化？
12 Is the IC tray loading polarity standardized for each type of polarity indicator that can be used for each component?
每一种类型的IC料盘上料极性是否被标准化？可用于每一种元件？
13 Is loading polarity referenced both from the tray and the component so as to ensure retrayed components are correctly loaded?
料盘和元件的上料极性是否都有标识以确保重新正确上料？
3. Nozzles, Feeders, and Tooling（吸嘴、料枪和工具）
1 Is there a document which details the standardized nozzle diameter set-up selected for each type of placement equipment?
是否有文件具体描述用于每种贴片设备的吸嘴直径选用标准？
2 Are these standardized nozzle diameter set-up documents readily available for when nozzles need to be replaced or changed?
当吸嘴需要更换或改变的时候，标准的吸嘴直径设定文件是否适用？
3 Is there a document which details the range of component XYZ body sizes that each selected nozzle type can successfully place?
是否有文件具体描述元件的XYZ本体大小范围使得每一个选择的吸嘴型号都能顺利贴片？
4 Is there a documented requirement to conduct daily nozzle centering and is there evidence that this is done?
是否有文件说明每日需要检查吸嘴中心度？是否有证据证明此动作有被执行？
5 Is each feeder identified with its own unique serial number?
每一个料枪是否都有自己唯一的序列号？
6 Is there a documented and effective Feeder Maintenance Program? Records (s/w or otherwise) must be by Feeder Serial Number.
是否有文件化的有效的料枪保养程序？记录必须按照料枪系列号。
7 Are database records maintained for each feeder serial number for the purpose of tracking its maintenance history and performance?
每一个系列号的料枪是否有数据库记录以追溯其保养历史记录和运作状况？
8 Is feeder maintenance history used to monitor feeder life so that problematic feeders can be removed from the process?
料枪保养记录是否用于监测料枪的使用寿命使得有问题的料枪能从制程中移走？
9 Can it be demonstrated that the number of feeder indexes is counted & monitored for each unique feeder using software or otherwise?
是否能证实料枪的送料次数计算和显示是由软件或其他方法计算每一个独立的料枪？
10 Is this information used to flag that feeder preventative maintenance is required after x number of indexes?
此信息是否用于指示料枪在送料X次之后需要采取预防保养措施？
11 Is there a documented requirement to indicate that Blocks or Support Pins are needed for specific products?
是否有文件指明对于特定的产品需不需要支撑块或支撑销？
12 Is the No, location, type and height of Support Blocks/Pins identified on a product by product basis? Score NA if in 3.11 there are not needed.
支撑块或支撑销的编号、位置、型号和高度是否基于产品的不同而予以区分？如果3.11条不需要模块或支撑脚，则此项为NA。
13 Are the Support Pin locations identified for each product using templates/tooling or some other effective solution? Comment as above.
对于每个产品所对应的支撑销位置是否使用模板/工具或其他有效解决方式？
4. Moisture Sensitive Devices
1 Are components stored before loading and after unloading in a manner which prevents damage?
元件在上料之前和卸料之后是否适当存储以防止损害？
2 Are the Moisture Sensitive Devices (MSDs) and their sensitivity level readily known to the operator?
作业员是否知道哪些是潮湿敏感器件以及敏感等级？
3 Are MSDs time stamped at opening and their exposure time monitored against pre determined limits?
潮湿敏感器件上所标识的开启和暴露时间是否符合预定的标准？
4 Is there a flag to indicate that the exposure time has been exceed for any given device in a dry box?
是否有标记指明干燥箱中的任何器件暴露时间已超标？
5 Is there a flag to indicate the MSD exposure has expired for any MSD device currently loaded in the placement machines?
是否有标记指明已上料到贴片机上的MSD器件暴露时间已超标？
6 Have MSD procedures been updated to reflect the JEDEC standard for MSD control? (J-STD-033C MSD released in July 2012)
MSD控制过程是否按照JEDEC的MSD控制标准更新？（J-STD-033CMSD标准于2012年7月颁发）
7 Is there evidence of correct implementation of J-STD-0033C for all MSD devices?
对于MSD器件，是否有证据证明正确执行J-STD-0033C标准？
8 Are there MSD procedures in place to ensure MSD shelf life is reduced based on measured Relative Humidity conditions?
MSD控制过程中确保MSD货架寿命是否基于确定的相对湿度条件下？
9 Is there a method in place to address the time spent in dry storage and its effect on remaining life based on MS Level and RH Level?
是否有适当的方法记录在干燥储存箱中花费的时间和基于潮湿等级和相对湿度等级对剩余寿命的影响？
10 Is it clearly understood that MSD 'shelf life' continues to degrade during dry cabinet storage of some MSD devices?
是否清楚知道MSD的货架寿命在干燥储存箱中也会持续缩短？（SFC在干燥箱中也要按比例计算MSD暴露时间）
11 If MSDs are on both sides of a PCBA, is there an effective method to account for time between 1st and 2nd reflow?
如果PCBA的两面都有MSD，是否能有效计算两面回流之间的时间？
12 Can MSD control be demonstrated for MSD devices that need internal/external pre-programming?
MSD控制程序是否涵盖到需要预先烧录的元件？
13 Can MSD control be demonstrated for rejected devices and devices used for rework?
是否可以证明MSD控制管制到不良的器件和返修用的器件？
14 Have MSD recovery methods been defined and adequate for all component types?
MSD恢复方式是否有定义且充分使用于所有型号的元件？
15 Does the control of Moisture Sensitive Components include those components on reels?
对于潮湿敏感性元件的控制是否包括卷盘上的元件？
16 Is the baking or hot room storage time and temperature documented and controlled for component recovery?
烘箱的烘烤时间和温度是否文件化并控制以使元件恢复？
17 Has this time and temp been determined based on the component supplier's guidelines / J-STD-0033C?
这个存储时间和温度是否依据元件供应商/J-STD-0033C的指示决定？
18 Is there evidence to demonstrate that the control process for MSDs is in use and is effective?
是否有证据证明MSD的控制是有实施且是有效的？
5. Machine Capability（机器能力）
1 Are Component Placement Programs generated from CAD XY coordinate data?
贴片程序是否根据CAD的XY数据得来？
2 Is there a standardized nomenclature for Shape Code definition?
是否有定义标准的外形代码(Shape Code)命名方法？
3 Can this nomenclature be used to determine the most appropriate shape code to allocate to a given part of given dimensions?
此命名方法是否可以用来决定最恰当的Shape Code以便分派给指定的元件/指定的尺寸？
4 Are localized fiducials used for fine pitch devices when localized component fiducials exist on the board?
当板上有局部基准点时，是否用于细间距器件？
5 Has manual component moving been eliminated given correct CAD, nozzle set-up, Shape Code allocation, local fiducials, Cam speed, etc?
是否通过给出正确的CAD数据，吸嘴设定，Shape Code分配，局部基准点，凸轮速度等来消除人工移动元件？
6 Does the Fine Pitch placement machine have the capability to check lead Coplanarity in xyz?
细间距贴片机是否具有检查元件脚在XYZ方向上共面的能力？
7 Does the Fine Pitch placement machine use its coplanarity capability on all leads of 20 mil pitch or less, and all programmed parts?
细间距贴片机是否使用检查共面的功能来检查20MIL或更小间距的元件脚,和已编程的元件？
8 Does the Fine Pitch placement machine have the capability to check ball arrays? If no such device, score NA.
细间距贴片机是否具有检查球栅阵列的能力？如果没有，该项得分为N/A。
9 Does the Fine Pitch placement machine use its ball array verification capability for all BGA devices? If no such device, score NA.
细间距贴片机是否使用其确认球栅阵列的能力来检查BGA？如果没有该能力，该项得分为N/A。
10 Is the machine Program Name revision controlled to show traceability of program changes?
机器程序名称是否受版本控制以显示对程序变更的追溯？
11 Is the machine Program Name traceable to the PWB and PCBA part number?
机器程序名称是否可以追溯到PWB和PCBA 料号？
6. PCBA
1 Are outputted boards at least sample inspected pre reflow for placement positional accuracy for machine control purposes?
在进入回流焊之前，生产出来的板子是否至少经过样板贴片准确性检验以确认机器控制？
2 Is the frequency for this verification defined and documented, and is there evidence to suggest it is followed?
此确认动作的频率是否有定义且文件化？是否有证据证明有被遵照执行？
3 Is there a visual aid available which identifies the populated locations with polarity, and also the no-pop locations?
是否有目视辅助工具来辩识板子组装的元件极性，以及那些没有组装的位置？
4 Is there a placement standard pre reflow to validate placement accuracy for the shape code, nozzle allocation, etc. parameters used?
为了确定Shape Code、吸嘴配置等参数的影响，是否有回流焊前的贴片标准？
5 Is there evidence to demonstrate that action is taken to adjust the machines performance for when this standard is exceeded?
是否有证据证明当超过标准的时候，有调整机器性能？
7. Attrition Rates and Rejected Components（损耗率和被抛弃的元件）
1 Is attrition rate monitoring conducted systematically to ensure feeder and/or nozzle problems are captured at least hourly?
是否有系统地对损耗率进行监测以确保料枪和/或吸嘴的问题能至少每小时及时发现？
2 Is there documented evidence to ensure attrition rates are checked and actioned at least hourly to ensure process control?
是否有文件证明至少每小时检查一次损耗率和采取行动以确保制程控制？
3 Is there a specification defined for acceptable attrition rates for the individual feeders?
是否有一个规范定义单个料枪的可接受的损耗率？
4 Is there a specification defined for the maximum allowable number of nozzle skips per machine before it is shut down for repair?
是否有规范定义在停机检修之前最多可允许跳过的吸嘴数目？（BY PASS数）
5 Are these specifications determined based on a percentage combined with the number of placements for a given time period?
这些规范的定义是否基于一个在给定时间内贴片数量的百分率来决定？
6 Is there evidence to demonstrate that attrition rate monitoring is conducted, effective, and used to make process control decisions?
是否有证据表明损耗率监测被有效执行且用于制程控制决策？
7 Is there a documented process for the disposition or reuse of machine rejected components? Rs and Cs must not be reused even for rework.
是否有文件化制程规定对于被机器抛弃元件的处理和重新使用？电阻和电容不可再使用，即使用于返修。
8 Are rejected components reviewed and repaired to ensure conformance before reuse, even if only used for rework?
机器抛料在重新使用之前是否检查和整理以确保其一致性，即使是只用于返修？
9 Are there repair blocks available or a lead conditioner in use for repairing 'real' Coplanarity rejects? Score 0 if parts not repaired.
是否使用维修治具或引脚整形器整理共面性不好的元件？如果没有整脚该项目0分。
10 Does the re-traying process always ensure that component polarity wrt the tray and the component loading polarity is preserved?
重新放元件回托盘的过程是否总能确保元件极性符合在托盘上的方向以及上料方向？
11 Is there a documented Process Deviation procedure to manage machine skips for hand placement if hand placement is allowed?
如果允许手工贴片，是否有文件化的制程差异程序来管制用人工来贴的元件？
8. Process Capability（制程能力）
1 Has a Process Capability Analyses (PCA) been conducted and the Cpk acceptable for the suite of shape codes in use?
是否进行制程能力分析而且Cpk能被在使用的Shape Code接受？
2 Were shape code allocations, component nozzle allocations, cam speeds, etc. recorded for this PCA?
制程能力分析中是否记录了SHAPE CODE分配，元件吸嘴分配，凸轮速度等？
3 Are the recorded shape code allocations, component nozzle allocations, and cam speeds, the same as those used today?
记录的SHAPE CODE分配，元件吸嘴分配，凸轮速度等是否和当前使用的一致？
Reflow Soldering
Reflow Soldering（回流焊）
1. Work Instructions（作业指导书）
1 Is there a revision controlled Operator Work Instruction which contains set-up information for the specific product being reflowed? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的作业指导书包括回流焊设定信息？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the operator and are they followed at Reflow?
作业指导书是否适用于操作者并且被确实遵守？
3 Is the conveyor speed set point specified on the Work Instruction and is it the same as that specified in the program?
作业指导书是否指明传输带速度并且和程序中的一致？
4 Are the temperature set points specified on the Work Instruction and are they the same as those specified in the program?
作业指导书中是否指明温度的设定点并且和程序中的一致？
5 Do Work instructions indicate if pallets or other tooling are required?
如果需要用托盘或其它工具，作业指导书是否指明？
6 When center rail support is required, do Work instructions indicate this requirement and is the location specified?
如果需要中心支撑导轨，作业指导书是否指明这个需求和规定位置？
7 Is the machine Program Name specified on the Work Instruction or set-up sheets?
作业指导书或设定说明中是否指明机器程序名称？
2. Machine Capability（机器能力）
1 Is the Reflow technology in use suitable for the product being built? Must be full forced Convection with sufficient zone count.
回焊炉所使用的技术是否和生产的产品相符合？必须是强制对流且具有足够的温区。
2 Are air flow controllers or a centralized control system used to balance exhaust flow rates for each individual exhaust drop?
是否有气流控制器或中央控制系统来平衡每个废气口的废气排放流量？
3 Are exhaust flow rate ranges specified and monitored on a regular basis to insure compliance?
废气的排放流量是否有规定并且有监控？
4 Is the machine Program Name revision controlled to show traceability of program changes?
机器程序名称版本是否受控以追溯程序的变更？
5 Is the machine Program Name traceable to the PWB and PCBA part number?
机器程序名称是否可以追溯到PCB,PCBA料号？
6 Is access to the machine program password protected with restricted access?
程序密码是否受保护以控制进入权限？
7 Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer?
在机器控制过程中关键参数的变更是否不能存储除非由技术员或工程师同意？（防止误动）
3. Temperature Profile（温度曲线）
1 Is there available a Temperature Profile for the product currently being built?
当前生产的产品是否有可用的温度曲线？
2 Is the Temperature Profile assessable and readily available to operators / technicians as and when required?
当需要时，作业员和技术员是否可以随时取得适用的温度曲线？
3 Were the Temperature Set Points and Conveyor Speed logged for that Thermal Profile when it was conducted?
温度设定点和传输带速度是否有被记录成温度曲线？
4 Do the Temperature Set Points & Conveyor Speed written on the Thermal Profile correspond to the current Program settings?
温度曲线上的温度设定点和传送带速度是否和当前的程序设定一致？
5 Is there available an Engineering based specification to detail the acceptable process window for Temperature Profiles?
是否有基于工程上的规格以具体描述温度曲线的可接受范围？
6 Was the Engineering based spec. derived from the Paste & Component manufacturer's recommendations but controlled to a narrower window?
工程规格是否从锡膏制造商以及元件制造商建议所得但是比建议更加严格？
7 Does the product Temperature Profile fall within the Engineering based specification for the process window?
产品温度曲线是否落在基于工程规格的可接受范围？
8 Does the product Temperature Profile fall within the Engineering based specification for glass transition temperature requirements?
对于玻璃转化温度需求，产品温度曲线是否适合基于工程要求的规格？
9 Can any excursions outside of the process window be justified and supported with hard evidence and logical analysis?
是否任何超出规格的点可以被证明是可接受的而且可以有相关证据证明并且有合理的分析？
10 Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?
产品的温度曲线是否依照SMT元件制造商的要求？
11 Are the boards used to establish the initial Thermal Profile kept as engineering samples?
用于建立初始温度曲线的板是否保留当作工程样板？
12 Is there evidence that a once off comparison study been conducted for a loaded versus an unloaded oven?
是否有证据表明对于从有载回焊炉和无载回焊炉测量所得的温度曲线进行过比较研究？
13 Have at least five thermocouples been used at various points on the board to establish the Thermal Profile? Note*
建立温度曲线的时候，是否最少用到5只热电偶来测量板子的不同位置？
14 Is there a documented and systematic approach used to identify the most appropriate locations to attach the thermocouples?
是否用文件化且系统化的方式来辩识最合适的位置以贴上热电偶？
15 Can it be demonstrated that a BOM review was conducted to verify that the chosen profile is appropriate for all specific component conditions?
是否能证明BOM检查有实施，用来验证选中的温度曲线符合所有的元件参数要求？（SFC在SMT炉前还要较验元件耐温）
16 Is there evidence that each thermocouple ball was bonded to a board joint using Hi Temp. Solder or Conductive Epoxy?
是否有证据表明每一个热电偶球都是用高温焊锡或导热环氧胶来和板子的点相连结？
17 Is there the capability to detect a temperature zone failure and to trigger an alarm automatically if this occurs?
是否有能力发现温区不良并且自动发出警报？
18 Has a Calibration Profile been established in order to detect machine long term performance degradation?
是否建立一校准曲线来探测机器性能的退化？
19 Is there a documented frequency for running a Calibration Profile and was it established based upon historical performance data?
是否有文件定义校准曲线进行的频率？是否基于所纪录的实际性能数据而建立？
20 Is there evidence to demonstrate that Calibration Profiles are conducted and that records are up-to-date?
是否可以证明校准曲线有被执行且记录是最新的？
21 Is the practice of comparing the current Calibration Profile to the Standardized Calibration Profile used to identify changes?
是否将当前校准曲线和标准校准曲线比较以确认变化？
22 Is the current Calibration Overlay/Profile used to determine if a variation in the ovens thermal characteristics has occurred?
现行的校准覆盖图/曲线是否用以测定炉温性能的变化？
23 Is the current Calibration Overlay/Profile used to determine if a variation in conveyor speed has occurred?
现行的校准覆盖图/曲线是否用以测定传输带速度的变化？
24 Is there evidence to demonstrate that action was taken when the Calibration Profile was different to the Standard?
是否有证据可以表明当校准曲线和标准不同的时候，有采取改善措施？
25 Is a standardized tool, like an OvenRider, used with a standardized profile to conduct a Calibration Profile?
是否有标准化的工具，比如OvenRider,生成标准温度曲线，用于校准温度曲线？
4. Manual Inspection (NA allowed, for questions in this section if AOI is deployed)（人工检验（如果有配置AOI，这部分的问题得分允许NA））
1 Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?
过回焊炉前的板子是否至少检验样品的贴片不良，缺件和焊锡不良？
2 Are Workmanship Standards defined for placement and soldering, and are they accessible and used to determine board acceptability?
是否定义贴片和焊接工艺标准？是否易懂并且用以决定板的可允收性？
3 Are Inspection Templates available and used to identify missing & unpopulated components and component polarity post reflow?
过回焊炉后是否用检验罩板检验缺件，未组装元件和元件极性？
4 Are Inspection Templates or Visual Aids used to identify ICT not tested components post reflow?
过回焊炉后是否用检验罩板或目视辅助工具来检验没经ICT测试的元件？
5 Are Templates readily accessible for verification purposes?
出于验证的目的，检验罩板是否好用？
6 Are Inspection Templates revision controlled and traceable to the current product ECO level?
检验罩板版本是否受控并能追溯到产品的ECO版本？
7 Is there a point and click software tool post reflow which is linked to CAD or program data to facilitate component identification for rework?
回焊炉后是否采用和CAD或者程序数据相连的软件工具来帮助返修时元件辩识？
8 Is there a documented requirement to conduct at least sampling X-ray inspection for BGA devices, and is there evidence that it is practiced?
是否有文件规定对于BGA元件至少需要进行抽样X-RAY检验，是否有证据表明此动作有被执行？
5. Automatic Inspection (NA allowed, for the cells indicated)（自动检查）
1 Are AOI/AXI complementary methods, which include solder joint inspection, used for all reflowed parts?
对于所有过回焊炉的元件，是否采用AOI/AXI方式检查焊点？
2 Is the AOI coverage % calculated based on the board OFE for a given side vs the total # of joints/components inspected?
AOI覆盖率是否基于所给板面的OFE和所检验的全部焊点/元件数相比较而计算得来？
3 Are the components/joints not covered by AOI documented and known and targeted for visual inspection?
对于没有被AOI覆盖的元件/焊点，是否有文件注明并成为目视检验的目标？
4 Is there evidence that the AOI coverage is verified periodically by using ICT and manual inspection feedback data?
是否有证据表明AOI的覆盖率有周期性的检验？
5 Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false?
是否可以证明机器的“发现不良”报警有经过操作员的检查并判断其是否是真的不良还是误判？
6 Can it be demonstrated that the operator been fully trained and certified to interpolate the AOI images presented?
是否可以证明操作员经过完全训练并可以对AOI显示的图面进行更改？
7 Does the ICT pareto of defects suggest that AOI is being 100% deployed and is being effective?
ICT不良柏拉图是否用以建议应100％采用AOI测试并使之有效？
8 Can it be demonstrated that AOI detectable ICT failures are feed back to AOI to improve program and operator effectiveness?
是否能证明AOI可测试，而ICT测试失败的数据有反馈给AOI以提高程序和操作者的水平？
9 Are rejected boards automatically stopped on the line post operator false call validation?
拒收的板子是否可以自动停在生产线上，以便操作者确认是否不良？
10 Are changes to AOI coverage made based only on performance feedback?
对于AOI覆盖率的变更是否仅基于成效之反馈？
6. Process Control
1 Is there evidence that the SPC used to monitor output post reflow, is effective at identifying & correcting process performance issues?
是否能证明SPC用于产品回焊炉后监视，且能有效识别和纠正制程状况？
2 Is the processes DPMO and the products DPU monitored in real time? ('real-time'=now)
是否实时监测制程DPMO和产品DPU?
3 Is OFE data readily available and calculated in accordance to the Dell documented procedures? (Doc. No. COR.40.WWP.SQ.1209)
OFE数据是否适用并且和DELL的文件化程序一致？
4 Is AOI data used to calculate SMT's DPMO? Score 0 if AOI deployed and not done.
是否采用AOI的数据计算SMT的DPMO?如果有安装AOI而没有这样做，该项为0分。
5 Are ICT debug results used to re-calculate SMT DPMO as a true measure of SMT DPMO?
ICT调试结果是否用以计算SMT的DPMO以取得真实的SMT的DPMO?
6 Is the data collected meaningful and can it be demonstrated that it is used to make process control decisions?
数据收集是否有意义？是否能证明用以对制程控制进行决策？
Manual
Manual（手工插件）
1. Work Instructions:Enter 1 or 0. NA may be a valid response for shaded cells.^
操作说明书
1 Are revision controlled Work Instructions displayed for the operator at each assembly station? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于每一装配岗位的每个作业员是否有一版本受控的作业指导书？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are component part numbers and their descriptions specified on Work Instructions?
零部件的数量和型号是否在操作说明中详细说明？
3 Are component descriptions sufficiently detailed to ensure the correct component is being used?
元器件的（特征）描述是否足够详细以确保元器件的正确使用？
4 Are the reference designators and the quantity per part number specified on Work Instructions?
每个物料的位号、数量是否在操作指导书中说明？
5 Is component polarity or its non-existence consistently and unambiguously specified on Work Instructions?
元器件的极性或方向是否清楚、标准化地标识在操作说明书中？
6 Are the components on the Work Instructions listed by the most appropriate order of insertion?
操作说明上的元器件是否按最适当的插入顺序排列？
7 Is the layout of lin bins/trays defined on Work Instructions for each assembly station?
各个岗位的物料盒布局(位置）是否在操作说明书中规定？
8 Are all lin bins/trays located in the correct position as per Work Instructions for each assembly station?
各个岗位物料盒的位置是否按操作说明书的规定放置？
9 Do Work instructions indicate if solder pallets/carriers or breakers must be used?
操作说明是否说明一定要用solder pallets/carriers(焊接托盘）或挡锡条？
10 Do Work instructions indicate if a top hat, separators, plugs, Kapton tape, finger protection, etc. must be used?
需要用到的安全帽、手套等物品是否有在操作说明中体现？
11 Does the direction of build for the board align with the orientation of the board on the Work Instructions and Wave direction?
插件时板子的摆放方向是否和操作说明书指示的，以及过波峰焊的方向一致？
12 Do Work Instructions not only indicate what components need to be inserted but also the buddy check components?
操作说明能否不仅指出需要插什么元器件同时还指出要互检（以及如何互检）
13 Is the conveyor at entry to the wave, slower than the wave conveyor speed, and documented on Work Instructions?进入波峰焊机的速度是否慢于波峰焊本身的传输速度，并在操作说明中明确说明？
14 Is there a documented process for the identification and control of non-completed boards resulting from breaks, shift changes, etc.
是否有文件化的程序来识别和控制因休息/换班等原因产生的未完成板。
15 Is the PWB part number and Revision specified on the Work Instruction or line set-up instructions?
PWB的物料编号和版本是否在操作指导书或Line set-up文件中明确说明？
16 Does the PWB part number and Revision cross-reference to the PCBA part number and Revision?
PWB的物料编号和版本是否能与PCBA的物料编号和版本相对照。
2. Station Breakout 工位安排
1 Is there a document available which describes the guidelines for station breakout at Manual Assembly?
在手工装配线是否有文件指导排站的原则？
2 Has the number of assembly stations required been determined scientifically in order to maximize throughput within constraints?
装配岗位数是否按科学方法算出的，在现有条件下取得最佳的产能？
3 Is there evidence that the line is evenly balanced with the defined number of stations and the defined station breakout?
是否有证据表明在规定的工位数和工位安排下生产线是平衡的？（没有堵线的情况）
4 Is there evidence to demonstrate that the assembly operators follow the defined station breakout on the Work instructions?
是否有依据可以表明装配工人遵循操作说明上的工位安排吗？
5 Is there evidence that sufficient time is allocated for component insertion at each station, as determined by the beat rate of the line?
是否有依据可以表明每个插件工位按照要求的节奏有足够时间来作业？
6 Does following the breakout ensure that the insertion of subsequent components is not restrictive or increased in difficulty?
工位安排应考虑到后续工位插件不会受到限制或困难度变大？
7 Does following the breakout ensure that 'snap-in' type components are inserted first or off-line?
工位安排是否确保有卡钩元器件(在第一站)先插或在线外插吗？
8 Does following the breakout ensure that components that 'look' alike are assembled at different and non-adjacent stations where possible?
在可能的情况下，工位安排能确保外形相似的元器件在不同并且不相临近的工位装配？
9 Does following the breakout ensure that components that 'fit' alike are assembled at different and non-adjacent stations, where possible?
在可能的情况下，工位安排能确保脚型相似的元器件在不同并且不相临近的工位装配？
3. Line Set-Up and Verification 排线和确认
1 Are all Manual Assembly station set-ups verified according to Work Instructions and a log signed prior to start-up & re-start?
是否所有手工装配岗位在开线前按照操作说明进行核对，并做记录？
2 Are first-built boards verified against documentation for missing components, value, and for correct polarity pre Wave?
第一块板在过波峰焊前是否有对照文件来检验缺件、数值、和正确极性吗？
3 Are the components supplied to Manual Assembly appropriately prepped with correct lead length, forming and pitch, etc.?
供给手工装配的元件是否有合适地预加工正确的引线长度、成型和间距吗？
4 Is it evident that lead snipping has been minimized through adequate component prep and/or pallet support design?
是否有证据表明通过适当地预加工和/或合适的过锡炉的托板设计，使得剪脚作业已经降到最少了。
5 Are all totes or tray locations identified with printed part numbers, descriptions, circuit designators, station number, and/or layout information?
是否所有的料盒都有印刷的标签，包括 物料编号、描述说明、电路符号、工位编号和/或摆放位置 ？
6 Are boards conveyed along the line automatically without the need to manually push the board forward or pull the board back?板在线上是否可以自动传输而不需要人工推动板的前进与后退？
4. Tooling
1 Is tooling used to provide underside support on all sides, to minimize flexing, for the insertion of components that require a force or snap-in fit?
对于插入的元器件需要用一定的力或卡钩装配的，是否有治具来支撑每一边，以将变形降到最少？
2 Is tooling used and is it adequate to prevent board flexing during all component insertion?
是否有用治具并且治具适当防止了所有元器件插件时印制板产生的变形？
3 Is tooling used for snap-in components prone to bent pins, to verify the pin straightness prior to their insertion?
多脚元件在插件前是否用治具试插以防止弯脚？
4 Is there a document available which describes the guidelines for pallet/carrier design?
是否有规定如何设计过锡炉托盘的指导方针的文件？
5 Are footprint, co-planarity, depth below datum, ID, clamping mechanisms, chamfering, direction of flow, criteria addressed?
过锡炉托盘设计的指导文件是否包含 ：footprint, co-planarity, depth below datum, ID, clamping mechanisms, chamfering, direction of flow？
6 Are pallets/carriers identified by a name or tooling number which is traceable to the PCBA part number and revision?
托盘/托架是否标识有可追溯到PBCA部件号和版本的名称或治具编号？
7 Is pallet/carrier orientation to the line specified or indicated and correct?
托盘/托架使用的方向是否正确标识且正确无误？
8 Are pallets/carriers designed such a way that they support all non-snap-in components without the use of weights?
托盘/托架的设计是否考虑到所有无卡勾元件过锡炉时也可以不需要重物来压？
9 Are pallets/carriers appropriately milled out to avoid shadowing and insufficients?
料盘/料架是否适当的倒角以避免阴影和锡不足现象？
10 Do selective wavesolder pallets/carriers use built in solder thieves to help reduce the occurrence of solder bridging?
托盘/托架是否有'solder thieves'以减少搭锡的发生率？
11 Is there a documented requirement to clean pallets/carriers and to regularly inspect them for damage and is there evidence of this?是否有文件规定清理托盘/托架，并定期检查是否损坏。是否有证据表明此要求有被执行？
12 Are pallets/carriers in a good state of repair, clean, and satisfactorily stored to prevent damage?
托盘/托架是否有良好的维修，清洗，和妥善存放以避免损坏？
5. Manual Inspection
1 Are outputted boards 100% inspected pre wave (Top Side) for missing components, value and polarity?
波峰焊前板子(元件面)是否有被100％检查，包括元器件的缺件，数值和极性是否正确？
2 Is there evidence to demonstrate that this quality inspection is conducted?
是否有证据表明这个质量检验有被执行？
3 Is there a visual aid (hard copy or otherwise) which identifies the populated locations with polarity, and also the no-pop locations?
是否有目视检查的辅助工具（复印件或其他工具)， 以表示有零件安装的位置（包括极性）和没有零件的位置？
4 Is there a buddy check system used between stations to ensure the previous operation has been fully completed?
工序之间是否有互检程序以确保前道工序已很好完成？
5 Is there evidence to demonstrate that a buddy check system is deployed between assembly stations?
是否有证据可以证明互检程序已经在工序之间进行？
6 Is the touch method used as part of the buddy system?
触摸的方法是否作为互检程序的一部分？
7 Are manually inserted components that are not tested by ICT specifically targeted for inspection in addition to the buddy check?
ICT不能检测的手插元器件除了互检外是否还有特别标示？
8 Is there evidence to demonstrate that at least an hourly defect feedback process to Manual Assembly is in operation and effective?
是否有证据表明向手工装配至少每一小时作一次缺陷反馈的程序有效地运行着？
9 Is accountability for Manual Assembly defects traceable to a specific workstation and operator/supervisor?
手工装配失误的责任有办法追溯到具体的生产线和操作者、管理者吗？
10 Are snap-in connectors inspected for bent pins post-insertion? (Tooling or an alternate method with proven effectiveness must be used).
有卡勾连接器插入板子后要检验是否弯脚(一定要用有效的治具或类似的方法)
Wave
Wave（波峰焊）
1. Work Instructions:Enter 1 or 0. NA may be a valid response for shaded cells.
1 Is there a revision controlled Operator Work Instruction which contains set-up information for the specific product being processed? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于正在生产的指定产品是否有一版本受控的作业指导书包括设置信息？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the operator and are they followed at Wave?
作业指导书对于操作者是否易于取得？是否有遵照执行？
3 Do Set-Up Sheets specify the Solder, the Flux, and the thinners (as applicable) to be used?
操作说明是否规定了所使用的焊锡、助焊剂和稀释剂？(如果有用到)
4 Do Set-Up Sheets specify the Spray Flux parameter settings such as delay, duration, traverse speed, pressure, etc?
操作说明是否规定了喷助焊剂的参数如延迟时间、喷雾时间、移动速度、气压等？
5 Do Set-Up Sheets specify the Pre-Heater set points and the Solder Pot Temperature and are they the same as those on the machine?
操作说明是否规定了预热温度和锡炉温度，这些参数是否与机器上的实际值一致？
6 Do Set-Up Sheets specify the Conveyor Speed and is it the same as that in the program?
操作说明是否规定了传输速度并且其与程序中的一致？
7 Do Set-Up Sheets specify the Lead Clearance and is it the same as that set by the machine?
操作说明是否规定了锡炉喷嘴到基板的距离并且其与机器设置的一致？
8 Do Set-Up Sheets specify Wave Type (Chip/Lambda/Omega) to be used?
操作说明是否规定了使用的何种类型的波峰（Chip/λ/Ω波）？
9 Do Set-Up sheets specify the Solder Pot Hot Air Knife Pressure and Temperature settings?
操作说明是否规定了锡炉热风刀气压和温度设置？
10 Do Set-Up sheets specify if the Finger Cleaner must be on? No Finger Cleaner = 0
操作说明是否规定卡爪清洁器必须使用？（无卡爪清洁器得0分）
11 Is the machine Program Name specified on the Work Instruction or set-up sheets?
机器程序名在作业指导书和操作说明上是否有规定？
12 Do the all the above wave parameter settings correspond to those settings on the machine?
以上的所有波峰焊参数设置与机器上设置的是否对应？
13 Are Generic Wave Set-Up Parameters documented? These are the parameters which are not changed for product changeovers.
是否有文件化规定通用的波峰焊设置参数？这些参数不随生产的产品变更而改变。
14 Do these Generic Wave Set-Up Parameters include, pressure settings, conveyor angle, etc.
这些通用波峰焊设置参数是否包括气压设定、导轨角度等？
2. Machine Capability机器能力
1 Is the flux application technology in use suitable for the product being built?
所用的助焊剂适用技术是否与正在生产的产品相适应？
2 Is the wave technology in use suitable for the product being built in terms of the ability control critical parameters to achieve desired results?
所使用的波峰焊技术是否与正在生产的产品相适应，能根据控制关键参数的能力以取得期望的结果？
3 Does the wave use a top side pre-heater to ensure PTH barrel fill meets IPC 610 specs given the mass of the board, carrier, and the top hat?
波峰焊有没有用顶部预热器以确保穿孔件（PTH）吃锡量满足IPC610上给出的规格;
4 Are air flow controllers or a centralized control system used to balance exhaust flow rates for each individual exhaust drops?
是否有气流控制器或中央控制系统来平衡每个废气口的废气排放流量？
5 Are exhaust flow rate ranges specified and monitored on a regular basis to insure compliance?
废气的排放流量是否有规定并且有监控？
6 Is Automatic Wave Height control installed to control the laminar wave height?
有没有安装自动波高控制器以控制层波波高？
7 Is there a Solder Pot Hot Air Knife installed and used on the wave equipment?
有没有安装并使用锡炉热风刀？
8 Is there an automatic Finger Cleaner installed and used on the wave equipment with an appropriated cleaning fluid? No FC = 0
是否有安装自动卡爪清洁器，并使用合适的清洁剂？
9 Is the machine Program Name revision controlled to show traceability of program changes?
机器程序名的版本是否受控以显示程序变更可追溯性？
10 Is the machine Program Name traceable to the PCB and PCBA part number?
程序名是否可以追溯到PCB和PCBA的物料编号？
11 Is access to the machine program password protected with restricted access?
程序密码是否受保护以控制进入权限？
12 Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer?
在机器控制过程中关键参数的变更是否不能存储除非由技术员或工程师同意？（防止误动）
13 Is the safety equipment and protective clothing provided adequate and are they used? Must include boots, apron, gloves, face shield, etc
是否有提供充足的安全装备及防护服并且有被使用？必须包括安全靴、工作裙、手套、面罩等。
3. Flux Application
1 Is flux applied using either a fixed nozzle or moving nozzle spray application method? Any other application method = 0
助焊剂是否既适用于固定喷嘴又适用于移动喷嘴的喷雾方式？其他任何方式得0分。
2 Can the sequence of; detection, delay, trigger, duration, and stop, be clearly explained by a technician? Other method = 0
锡炉工能否清楚地解释检测、延迟、触发、周期、停止的次序？
3 Is the detection, delay, trigger, duration, and stop, controls performing as expected? Other method = 0
检测、延迟、触发、周期、停止是否按预期要求进行操作？其他情况下得0分
4 Is there a feedback link between the conveyor speed and the flux applicator to auto-compensate for changes? Other method = 0
在导轨速度有变化时，助焊剂喷雾器有没有能自动补偿的反馈链？
5 Is there an automatic sensor that indicates when a flux drum is near empty?
有没有一个自动传感器表明助焊剂容器快空了？
6 Is there a method to determine if the quantity of flux applied to the board to ensure it adequate? Not too much and not too little.
有没有一种方法可以测定喷到板上的助焊剂的量是合适的？不太多也不过少。
7 Is there a test used to check the coverage of flux applied to the board to ensure it is sufficient?
有没有试验来检查喷到板上的助焊剂的覆盖面是否足够？
4. Wave Set-Up
1 Has specifying the Solder Pump Speed value been discontinued as a way to achieve the desired Wave Height?
为达到所期望的锡波高度，有没有调节锡炉泵速度阀？
2 Is the relationship between Wave Height set-up and Contact Area/Length known for the product being processed?
对于正在生产的板是否知道波峰高度设定和与板接触面积/吃锡长度之间的关系？
3 Is there a Quartz Plate available to verify Contact Area/Length achieved for the board being processed?
有没有高温玻璃板来证明过锡面积/长度满足正在生产的板的要求？
4 Is the documented Contact Area/Length being achieved for the Wave Height set-up used?
对于设定的锡波高度有没有达到文件规定的过锡面积/长度？
5 Does the shape of the Contact Area indicate parallelism?
过锡面的两侧的形状是否一致的？
6 Does the Contact Length coupled with the Conveyor Speed achieve the documented dwell time requirement?
与传送带速度相应的过锡长度是否达到文件要求的过锡时间要求？
7 Is there evidence that Contact Area/Length and shape verified after Solder Pot removal and replacement, and maintenance?
锡炉移开、归位和维修后有没有证据证明过锡面积/长度和形状有经过重新确认？
8 Is there evidence that the Contact Area/Length and shape verified on addition of solder or on adjustment of lead clearance?
当添加了焊锡或调整了锡炉喷嘴与板的距离时，有没有证据证明过锡面积/长度和形状有没有经过重新确认？
9 Does the board/pallet exit the Solder Pot in the stagnant area for the set conveyor angle and lead clearance?
设置导轨角度和锡炉喷嘴与板的距离时，锡炉内不能有板子？
10 Are all conveyor Fingers in a good state of repair?
所有的卡爪是否处于良好的状态？
11 Is the quantity, type and spacing of each Finger design defined for the conveyor?
每个卡爪的数量、类型和间距有根据传送带来设计？
12 Has the pot been set up to run with an intermittent wave so as to reduce dross build up? If gap between subsequent PCBAs too small, score 1
锡炉是否使用间断波以减少氧化物产生（没板子时停止锡泵）？如果相临板间的距离足够小，得1分
13 Does the level of Dross in the pot suggest that the pot is dedrossed at least once every 8 hours?
炉中的氧化物的量能不能表明至少每8小时清理了一次锡渣？
5. Temperature Profile
1 Is there available a Temperature Profile for the product currently being built?
是否可得到当前正在生产的产品的温度曲线？
2 Is the Temperature Profile assessable and readily available to operators / technicians as and when required?
当需要时锡炉工/技术员是否易于取得温度曲线？
3 Were the Pre-Heat Set Points, Conveyor Speed, and Solder Temperature logged for that Thermal Profile when it was conducted?
温度曲线上要有对照的锡炉参数（预热设置点、导轨速度和焊锡温度）设定点以做对照？
4 Do the Set Points, Conveyor Speed & Solder Temp written on the Thermal Profile correspond to the current Machine settings?
温度曲线上记录的设置点、传输速度和焊接温度是否与当前机器的设置相一致？
5 Is there available an Engineering based specification to detail the acceptable process window for Temperature Profiles?
是否有基于工程上的规格以具体描述温度曲线的可接受范围？
6 Was the Engineering based spec. derived from the Flux manufacturer's recommendations but controls to a narrower window?
工程规格是否从助焊剂制造商建议所得但是比建议更加严格？
7 Does the product Temperature Profile fall within the Engineering based specification for the process window?
产品温度曲线是否落在基于工程规格的可接受范围？
8 Does the product Temperature Profile fall within the Engineering based specification for glass transition temperature requirements?
对于玻璃转化温度要求，产品温度曲线是否适合基于工程要求的规格？
9 Can any excursions outside of the process window be justified and supported with hard evidence and logical analysis?
是否任何超出规格的点可以被证明是可接受的而且可以有相关证据证明并且有合理的分析？
10 Does the product Temperature Profile meet the requirements of the SMT components already attached to the PCBA?
产品的温度曲线是否满足已贴在PCBA上的SMT组件的要求？(SMT元件不可再过锡炉）
11 Are the boards used to establish the initial Thermal Profile kept as engineering samples?
用来建立初始温度曲线的所有的板是否作为工程样板予以保存？
12 Have at least five thermocouples been used at various points on the board to establish the Thermal Profile? Note*
有没有在板上的不同点用至少五个热电偶来建立温度曲线？
13 Is there a documented and systematic approach used to identify the most appropriate locations to attach the thermocouples?
有没有用文件化的系统的方法来标明将热电偶粘在最适合的位置？
14 Is there evidence that each thermocouple ball was bonded to a board joint using Hi Temp. Solder or Conductive Epoxy?
有没有证据表明每一个热电偶球都用高温焊锡或环氧导热胶与板上的点相连？
15 Is the top side Temperature Profile low enough to prevent secondary reflow? Must be below 160 degrees C.
板上部的温度曲线要足够低以防止二次回流？必须低于摄氏160度。
16 Has a Calibration Profile been established in order to detect machine long term performance degradation?
有没有建立校验温度曲线用来检测机器长期运转后的性能变化？
17 Is there a documented frequency for running a Calibration Profile and was it established based upon historical performance data?
有没有文件规定制作校验测试曲线的频率，它是不是根据历史数据来建立的？
18 Is there evidence to demonstrate that Calibration Profiles are conducted and that records are up-to-date?
有没有证据证明有使用校验温度曲线，并且记录是最新的？
19 Is the practice of comparing the current Calibration Profile to the Standardized Calibration Profile used to identify changes?
是否将当前的校验温度曲线与标准温度曲线作比较以用来表明变化？
20 Is the current Calibration Overlay/Profile used to determine if a variation in the wave's thermal characteristics has occurred?
当前的校验温度曲线有没有用来判定是否波峰焊的热特性变异已发生？
21 Is the current Calibration Overlay/Profile used to determine if a variation in conveyor speed has occurred?
当前的校验温度曲线有没有用来判定是否传送速度变异已发生？
22 Is there evidence to demonstrate that action was taken when the Calibration Profile was different to the Standard?
有没有证据表明当校验温度曲线与标准曲线不一样时采取了措施？
23 Is a standardized tool, like a WaveRider, used with a standardized profile to conduct a Calibration Profile?
有没有用标准化的工具,比如WaveRider, 用标准化的曲线来制作校验曲线？
6. Solder Analysis焊锡分析
1 Is there a documented frequency for conducting Solder Analysis and was this frequency established based upon historical results?
是否有文件化的实施焊锡分析的频率，并且这个频率是基于历史数据建立起来的？
2 Is there evidence to demonstrate that Solder Analysis records are up-to-date?
有没有证据证明焊锡分析记录是最新的？
3 Does the Solder Analysis results suggest that contaminants in the solder pot are within acceptable levels?
焊锡分析结果能否显示锡炉中的污染物在可接受的水平？
4 Is there evidence to demonstrate that action was taken when Solder Analysis results were unsatisfactory?
有没有证据证明当焊锡分析结果不能满足要求时有采取相应的措施？
7. Manual Inspection
1 Are outputted boards at least sample inspected post wave for wave solder defects as part of machine performance control?
产出的板有没有检查焊接缺陷(至少抽样检查)，用来作为机器性能控制的一部分？
2 Are Workmanship Standards defined for soldering, and are they accessible so that machine performance can be measured accurately?
是否定义了焊接工艺标准，并且工艺标准易于理解以便机器性能可以正确评估？
3 Is Defect Density Charting used to identify the common location of defects so that actions may be take to eliminate them? This may include addition of solder thieves, pallet/carrier modification, etc.
缺陷分布图是否用来表明缺陷所处的位置以便采取措施进行消除？可能包含加solder thieves，修改托盘/托架等。
4 Is there evidence of the use of at least sampling X-ray to ensure via penetration and barrel fill are to acceptable standards?
是否有证据表明，有用X-射线抽样检查来保证渗透和贯孔达到了可接受的标准？
PostWave
PostWave（后焊）
1. Automatic Inspection自动检查:Enter 1 or 0. NA may be a valid response for shaded cells.
1 Are AOI/AXI complementary methods, which include solder joint inspection, used for assembled components?
是否有使用包括焊点检验在内的AOI/AXI？
2 Is the AOI/AXI coverage % calculated based on joints/components inspected versus those not inspected?
AOI/AXI的覆盖率的计算方式是不是根据零件及焊接点来进行的？
3 Is AOI/AXI coverage at 100% with a sample size of 100% for New Product Introductions (NPI), until capability has been established?
对于新产品导入（NPI），直到过程能力已达到要求，AOI/AXI对所有样本的覆盖率是否达到了100%？
4 Post NPI, has AXI coverage and sample size been optimized based on cycle time and the use of complementary AOI strategies?
新产品导入后，AXI的覆盖率和抽样数有没有根据测试时间和AOI策略补偿性使用被优化？
5 If sample size is not 100%, can AOI/AXI process control be evidenced based on Dell Metric 2 performance?
如果样本数不是100%，能不能证明AOI/AXI程序控制是基于Dell Metric 2操作的？
6 Are the components/joints not covered by AOI/AXI documented and known and targeted for visual inspection (except BGA joints)?
是否有文件列出不能被AOI/AXI覆盖到的组件/焊点，并作为目视检查的对象（除BGA焊点外）？
7 Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false?
是否有证据表明机器报警后，操作人员有进行检查以判断是否机器误报？
8 Can it be demonstrated that operators have been fully trained and certified to interpolate the AOI/AXI images presented?
能不能证明操作者有经过足够地培训和认证，可以理解AOI/AXI的检验结果？
9 Does the ICT pareto of defects suggest that AOI/AXI is being effectively deployed as evidenced by Dell AXI/AOI Metric 2?
根据Dell AXI/AOI Metric 2，ICT不良柏拉图能否验证AOI/AXI测试是有效地？
10 Can it be demonstrated that AOI/AXI detectable ICT failures are feed back to AOI/AXI to improve program and operator effectiveness?
是否有证据表明, ICT检出的AOI/AXI应该可以检验得到的不良，有被反馈到AOI/AXI，以完善测试程序和提高操作者的能力？
11 Are changes to AOI/AXI coverage made based only on performance feedback?
AOI/AXI覆盖率的变更是根据检验结构的反馈来决定的
2. Work Instructions（工作说明）
1 Is there a revision controlled Operator Work Instruction which contains information for the specific product being inspected? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于正在检查的指定产品是否有一版本受控的作业指导书？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Do the Work Instructions specify the specific solder/flux/cleaning agent etc. to be used?
作业指导书有没有详细说明所使用的指定的焊锡/助焊剂/清洗剂等信息？
3 Do the Work Instructions define acceptable lead lengths and/or specific customer requirements?
作业指导书有没有规定可接受的引脚长度和/或特殊的客户要求？
4 Have the specific connector heights/lean acceptance and assembly requirements been addressed from the PCBA Assembly Drawings?
有没有在PCBA装配图上定义连接器高度/倾斜度的可接受范围和装配要求？
5 Are Work Instructions also used as an alert to flag specific customer or known issues?
是否有针对客户的特殊要求或者已知问题有特别标示在作业指导书上（或类似文件）？
6 Do the Work Instructions specify the specific inspection stamps and locations to be used? Score 1 if tracked using Forced Routing.
作业指导书上有没有明确指出检验后盖印及盖在什么地方？如果使用强制流程则得1分。
7 Do Work Instructions require AOI/AXI Paper Less Repair (PLR) data to be evaluated?
工作指导书有没有要求评估AOI/AXI无纸维修数据？
3. Manual Inspection (NA allowed, for questions 3.1 to 3.5 if AOI or AXI is deployed)
人工检查（如果有使用AOI或AXI，问题3.1到3.5不必回答）
1 Are outputted boards 100% inspected for wave solder defects and for lead evidence?
产出的板是否100%检查波峰焊缺陷数和元件引脚是否吃锡良好？
2 Are outputted boards 100% inspected for missing PTH components & polarity, and raised/tilted PTH components?
产出的板是否100%检查缺件、极性相反,浮件/歪斜？
3 Are outputted boards 100% inspected for those components and joints not covered by ICT or AOI/AXI?
产出的板是否经100%检查那些ICT或AOI/AXI检查不到的元件和焊点？
4 Are Workmanship Standards defined for soldering, and are they accessible and used to determine board acceptability?
是否定义了详细的焊接工艺标准，它们是否易于取得并用来判定板的可接受性？
5 Is there a visual aid available which identifies the populated PTH locations with polarity, and also the no-pop locations?
有没有目视辅助工具用来标示板上有极性的的元件和没有元件的位置？（可以用模板）
6 Are AOI/AXI Paper Less Repair (PLR) Stations effectively used at inspection for the evaluation of AOI/AXI defect calls?
检验中有没有充分利用AOI/AXI无纸维修（PLR）站来作AOI/AXI不良判定？
7 Is there a point and click software tool post reflow which is linked to CAD or program data to facilitate component identification for rework?
回流焊后有没有一个与CAD或编程数据相链接的指点软件工具来辅助维修时快速准确地识别不良元件？
8 Is it evident that lead snipping has been minimized through adequate component prep and/or pallet support design?
是否有证据表明通过适当地预加工和/或合适的过锡炉的托板设计，使得剪脚作业已经降到最少了
9 Is there a tool available and used to check component lead length against the required lead length specification?
有没有合适的工具用来检查元件的引脚长度是否符合规格要求？
10 Is it evident that only those leads which exceed the specification for component lead length are snipped?
是否有证据表明只有那些超出规格要求的部件引脚才被切掉？(减少不必要的剪脚作业）
11 Are magnification & lighting tools available at the inspection station? Magnification must be as per IPC based on component type.
在检验站是否有合适的放大镜和照明？放大镜的放大倍数必须与IPC上相应的要求一致。
4. Process Control过程控制
1 Is there evidence that the SPC used to monitor output post reflow, is effective at identifying & correcting process performance issues?
有没有证据证明用来监视回流焊后的产品质量的SPC对发现并纠正生产过程中的问题是有效的？
2 Is the processes DPMO and the products DPU monitored in real time? ('real-time'=now)
过程DPMO（每百万出错机会）和产品DPU（不良率）是否实时监测的？（实时=现在)
3 Is OFE data readily available and calculated in accordance to the Dell documented procedures?
OFE（出错概率）数据是否易于得到并且是根据Dell的标准程序计算出来的？
4 Is AOI/AXI data used to calculate Wave DPMO? Score 0 if AOI/AXI is deployed and not done.
AOI/AXI数据是否用来计算波峰焊的每百万出错率？如果有使用AOI/AXI但没有统计，得0分。
5 Are ICT debug results used to re-calculate Wave DPMO as a true measure of Wave DPMO?
ICT修理结果是否用来重新计算波峰焊的每百万出错率以得出波峰焊DPMO的真实测量数据？
6 Is the data collected meaningful and can it be demonstrated that it is used to make process control decisions?
数据收集是否有意义？能否证明这些数据用来决定过程控制情况？
MechAssy
MechAssy
1. Work Instructions
1 Is there a revision controlled Operator Work Instruction which contains details of how to assemble the product? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的作业指导书包括如何装配产品？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the operator and are they followed at Assembly?
操作者是否易于取得作业指导书并且确实遵照执行？
3 Are component part numbers and descriptions included on the Work Instructions?
作业指导书上是否包含有元件料号和品名描述？
4 Are components sufficiently identified to ensure the correct component is being used?
所有元件的描述是否具体以确保元件使用是正确的?
5 Is the layout of totes/trays defined on Work Instructions for each assembly station?
每个工作站的作业指导书上是否详细说明料盒的摆放位置？
6 Are all totes/trays located in a defined position as per Work Instructions for each assembly station?
所有的料盘是否按每个工作站的作业指导书上规定的位置摆放？
7 Do Work Instructions contain clear pictures to aid the operator & ensure the correct assembly method is understood?
工作指导书上是否包含清晰的图片以帮助操作者并保证正确理解装配方法？
8 Are torque settings and the sequence of screw insertion specified for screw assembly operations?
对于锁螺丝操作，是否有设定扭力矩和规定螺丝锁入的先后顺序？
9 Are all torque drivers set to the required torque and screws inserted in the right sequence?
所有气批/电批是否都设置在要求的力矩，并且螺钉按正确的顺序锁入？
10 Is there evidence that torque drivers are checked with a calibrated tool at least once a day to ensure the correct torque requirements?
是否有证据证明气批/电批每天至少用一校验工具检查一次以保证满足正确的力矩要求？
11 Do all torque drivers have 'lock nuts' to fix the torque setting after calibration to prevent operator adjustment?
所有的气批/电批在校验后是否有装置或标签(固定销)来固定力矩设置以防止操作者调整？
12 Are protective guides used to ensure that torque drivers cannot cause damage to the product due to operator error?
是否有保护措施用来保证即使操作者失误气批/电批也不致引起产品损坏？
13 Are all hand tools needed by the operator listed with their descriptions on Work Instructions?
操作者需要用到的所有手工工具是否在作业指导书上列出并有详细描述？
2. Board Tooling / Depanelization切板加工/掰板
1 Is breakout tooling specifically designed for the board or is a line-side Router or v-score machine used? Manual breakout=0.
切板加工工具是否特别为印制板设计，或者使用line-side Router(切边机)或or v-score machine(V形切割机)？采用人工切板的得0分
2 Can it be demonstrated that board flexing has been minimized and clearance is sufficient by using such tooling?
能否证明用这种工具时板的弯曲变形最小且间隙足够大？
3 For v-scored boards, are boards positioned using a fixture so that the cutting tool and can only cut occur along the v-score?
对于用V型切割机切割的板，是否有用夹具来固定板的位置以便切割只能沿着V型槽进行？
4 Can it be demonstrated that the board is supported before and after the cut so as to prevent board damage due to dropping?
能不能证明在切割过程中板子有合适的支撑，防止板在切割前后因掉落而受到损坏？
5 Does the press fit tooling use force feedback control that provides repeatable installation and prevents PWB damage?
用机械压力安装连接件的夹具是否有力反馈控制装置来提供重复安装，防止印制板损坏？
6 Has all tooling used at Mechanical Assembly been designed to minimize board flexing?
在机械安装中用到的所有的工具在设计时都有考虑尽量降低板的变形？
3. Heatsinks and Mechanical Bonding散热片和机械组件
1 Is heatsink installation tooling used to align heatsinks to the required orientation and position tolerance?
是否有用散热片安装工具来把散热片固定到所要求的方向和位置的允许范围内？
2 Is the force applied to the heatsink and the duration of the applied force documented on Work Instructions and controlled?
用在散热片上的力及作用时间是否在作业指导书上注明并且受控？
3 Is the dry time for the solvent document on Work Instructions and controlled?
溶剂的干燥时间是否在作业指导书上规定并受控？
4 Is there a process to control the volume of thermal adhesive and activator applied to ensure the required bond strength?
有没有控制导热胶和催化剂的用量以达到所需要的粘接力？
5 Is the cure time for the thermal adhesive documented on Work Instructions and controlled?
导热胶的固化时间是否在作业指导书上注明并受控？
4. Line Set-Up and Verification生产准备及验证
1 Are first-assembled boards verified against documentation to ensure mechanical items have been assembled correctly?
首件板是否依据文件予以核对以保证机构件被安装正确？
2 Are all totes or tray locations identified with printed part numbers, descriptions, locations, and layout information?
所有的料盒上是否用打印的“料号、规格、点位和摆放位置”标签标明？
3 Is the Mechanical Assembly work cell laid out ergonomically with components & assembly tools within easy reach?
机械组装工位是否按人体工学要求来放置各种部件和安装工具以方便取用？
4 Are mechanical items stored before and during use in a manner which prevents damage?
所有的机械部件在使用前或使用中是否采用了防止损坏的放置方式？
5 Are color coding techniques deployed for parts, tools, work instructions etc. in an attempt to error proof the process?
“颜色管理”是否应用到所有的部件、工具和作业指导书等等以确保整个过程不出现失误？
5. Manual Inspection人工检查
1 Is there evidence to demonstrate that a defect feedback process is in operation to Mechanical Assembly?
是否有证据证明在机械装配过程中的缺陷反馈按程序规定进行？
2 Are cosmetic standards are readily available to the assembly operator on the assembly line?
组装线上的操作工是否易于取得外观检验标准？
ICT
1. Operator and Work Instructions:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Is there a revision controlled Test Instruction which contains unique details for the specific product being tested? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的测试指导书？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the test operator and are they followed?
测试操作者是否易于取得作业指导书并且确实遵照执行？
3 Is the Fixture ID specified on Work Instructions?
夹具的序列号是否列于作业指导书中？
4 Is the Fixture ID traceable to a specific PCBA part number and revision level and to the Unit Under Test?
夹具的序列号是否可以追溯到特定的PCBA物料编号和版本？
5 Is the Batch File specified on Work Instructions?
批处理文件名是否规定在作业指导书上？
6 Is the Batch File traceable to a specific PCBA part number and revision level and to the Unit Under Test?
批处理文件名是否可以追溯到特定的PCBA编号和版本？
7 Is the Vacuum setting and range specified on Work Instructions?
作业指导书中是否列出真空压力的设定和范围？
8 Is the PCB orientation to the Fixture identified in the Work Instructions or on the Fixture?
PCB板相对夹具的方向是否标示在作业指导书或夹具上？
9 Does the test Operator have the Standard Operating Procedure (SOP) for the tester available to them at all times?
测试操作者是否有测试设备的标准操作程序且在任何时候都易于取得该操作程序？
10 Is there evidence that the Operator has been trained and certified against the Standard Operating Procedure for the Tester?
是否有证据证明操作者已受过训练并被鉴定能够依照测试设备的标准操作程序执行？
11 Does the Operator know the content of the Standard Operating Procedure for the Tester and do they and follow it?
操作者是否了解测试设备的标准操作程序内容并确实遵循执行？
12 Are Operators required to log in at the Test station and does this provide an automatic verification of training status?
是否有一个机制在作业员输入个人识别之后可自动核实其是否训练合格可以上岗。
2. ICT Fixture
1 Is the ICT fixture identified with a name or number?
在线测试仪的夹具是否进行命名或编号以便区分？
2 Is the Preventative Maintenance / Calibration sticker on the ICT fixture current and up to date?
在线测试仪夹具的维护保养/校准标签是当前的或最新的吗？
3 Is there a Preventative Maintenance procedure and schedule for ICT fixtures?
是否有在线测试仪夹具的维护保养程序和进度表？
4 Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
是否有证据表明维护保养记录是最新的？
5 Are spare test fixture parts (excluding probes) stocked?
库存中是否有测试夹具的备用部件（不含探针）？
6 Are spare test fixture probes stocked for each design required to support Dell fixtures?
库存中是否有适用于DELL夹具的备用测试探针？
7 Is the inventory of spare test fixture parts adequately controlled?
备用测试夹具部件的库存目录是否有适当的管制？
8 Are ICT fixtures adequately stored in such a way that the tester interface is protected?
在线测试仪的夹具是否以测试装置接触面受保护的方式适当保存？
3. ICT System Hardware
1 Is there a vacuum gauge on the line connected to the test system?
是否有真空计与测试系统在线相连？
2 Is a calibrated vacuum gauge visible to the test operator and is it at the correct setting within an acceptable range?
是否有操作者可直接看到的已校准的真空计？并且有正确设定在有效偏差范围内吗？
3 Is the Preventative Maintenance / Calibration sticker on the Test System current and up to date?
对测试系统的保养维护/校准标签是当前的或最新的吗？
4 Is there a Preventative Maintenance procedure and schedule for ICT Test Systems?
是否有ICT的维护保养程序和进度表？
5 Are the test systems pin electronics verified daily using the internal test?
测试系统是否用内部自动测试每天检查顶针的电气连接？
6 Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
是否有证据可以证明维护记录是最新的？
7 Are spare test system parts stocked?
库存中是否备有测试系统配件？
8 Are spare test system pin electronics boards stocked?
库存是否有备用测试系统顶针板？
9 Are the inventory of spare test system parts adequately controlled?
测试系统备用部件的库存目录是否适当管制？
4. ICT Software
1 Are all ICT test systems networked to a server?
所有的ICT测试系统都与服务器联网吗？
2 Is the ICT software downloaded from a central server when the program is called up or at least compiled once per day?
当ICT程序启动时的软件是否从一个中心服务器上下载或至少每天核对一次？
3 Is the ICT software revision controlled for program changes?
ICT的软件对程序变更是否做版本管控？
4 Are all changes to an ICT program, no matter how insignificant the change is considered, logged in the program or otherwise?
对ICT程序的变更，不管更改多小，都要记录在程序中或其他方法？
5 Is it impossible for unapproved ICT s/w changes to remain on the test system longer than 24 hours before recompiling the program?
在程序重新编译之前未经批准的ICT软件变更在测试系统保留不可以超过24小时。
6 When changes are made, is there evidence that change details are sent to Dell for approval?
当确定要更改程序，是否有证据证明更改的细节有送往Dell作审批？
5. Test Operation
1 Is there an automated method of loading test programs (i.e. the batch file).
是否有自动装载测试程序的方法？（即批处理文件）
2 Is the Fixture ID used to select and automatically load the correct ICT program for the unit under test?
测试夹具的标识号是否用于选择和自动装载正确的ICT测试程序？
3 If the same ICT fixture is used for different PCBA part numbers, does the Batch file automatically differentiate? NA may be used.
是否相同的ICT夹具用于不同的PCBA物料编号？批处理文件会自动区分吗？
4 Is there a foolproof method to ensure that product A will not pass ICT if Batch File B is used? NA may be used.
是否有防呆的办法来确保当使用批处理文件B时产品A将无法通过ICT测试？
5 Is there a foolproof method to ensure that product B will not pass ICT if Batch File A is used? NA may be used.
是否有防呆的办法来确保当使用批处理文件A时产品B将无法通过ICT测试？
6 Is the PCBA orientation to the fixture identified or is required to be checked before board loading?
PCBA相对夹具的方向在印制板装载时是否容易被识别或被要求检查？
7 Is the test program uniquely identified on the test system display after the test program has been loaded?
在测试程序装载后在测试系统上该程序是否可以很容易识别？
8 Is there a documented and agreed convention outlining the storage of untested, failed, and pass boards?
是否有文件规定 未经测试板、测试失败的板、和通过测试的板的 存放？
9 Are boards marked in some way to facilitate the implementation of this convention? (Forced Routing is acceptable.)
印制板上是否有做某些标记以利于该要求的执行？（强制行程安排也可接受的）
10 Are boards awaiting test identified and stored separately according to the convention OR routed via a dedicated conveyor?
等待测试的印制板是否依据要求分开进行标识和储存，或者通过专用的传送带传送？
11 Are passing boards identified and stored separately according to the convention OR routed via a dedicated conveyor?
通过测试的印制板是否依据要求分开进行标识和储存，或者通过专用的传送带传送？
12 Are failing boards identified and stored separately according to the convention OR routed via a dedicated conveyor?
测试不合格的印制板是否依据要求分开进行标识和储存，或者通过专用的传送带传送？
13 Are pass and failed boards stored on different storage carts OR routed via a unique conveyor?
合格与不合格的印制板是否储存在不同的储存车或通过专用的传送带传送？
14 Is SPC data collected and effectively used at this process point?
SPC数据是否收集并有效用在这一进程要点上？
15 Is the content of the SPC data chart up-to-date?
SPC数据图表的内容是否是最新的？
16 Are out of control SPC data points effectively actioned?
超出管制范围的SPC数据点是否有采取有效的措施？
17 Are ICT buffer trigger points established to ensure process shut down should the limits be exceeded?
是否确定待测试板最多可以堆放的数量，以便当待测试板过多时可以停线处理。
18 Has a Gauge R&R study been completed in accordance with Dell GR&R Procedures?
量测系统的重复性和重现性研究是否依据Dell的GR&R程序完成？
19 Has test coverage been calculated using the 7 Dell Metrics for ICT coverage, and is this readily available and known?
测试覆盖率是否用7个Dell Metrics进行计算？是否易于取得？
6. ICT WIP Tracking
1 Is a Forced Board Routing system and WIP Tacking system fully deployed throughout the test process?
强制的印制板行程安排体系和WIP跟踪体系是否在整个测试过程中充分运用？
2 Does the system verify the 'last' step processed and compare it to the expected 'last' step?
系统是否校验最后步骤并与预期的最后步骤进行比较？(是否板子有流过每个工位，没有步骤被跳过）
3 Do boards that PASS have an identifying mark to indicate their pass status? (Forced Routing is acceptable.)
PASS板是否有识别标识以显示其合格通过的状态？（强制的行程安排也可接受的）
4 Do boards that FAIL have an identifying mark to indicate their fail status? (Forced Routing is acceptable.)
不合格的FAIL板是否有识别标识以显示其不合格状态？（强制的行程安排也可接受的）
5 Do failed boards have ICT fail listings attached for debug purposes? (Paperless repair is acceptable)
不合格的板是否附有ICT不合格清单以便查错？（无纸传输信息的维修也可接受）
6 Do all debugged boards have an identifying mark to indicate a debug status? (Forced Routing is acceptable.)
所有的修理完的板是否都有识别标识以显示其状态？（强制的行程安排也可接受）
7 Is there a software link between ICT Test results & the Forced Routing/Quality Data System?
ICT测试结果和强制流程/质量数据体系间是否有软件链接？
8 Does this software link eliminate manual intervention to indicate the test result status?
这种软件链接是否排除人工干涉测试结果状态的显示
9 Is this link fully automated and used to log Test Yield/First Pass Yield & Board Yield data?
这种链接是否充分自动用于记录测试数量/一次合格数量/印制板产量数据？
10 Is FPY and BY readily known and has it been calculated in accordance with Dell definitions and specified retry conditions?
一次合格产量(FPY)和印制板产量(BY)是否简单易懂并根据Dell定义和指定的再测试条件进行计算的？
11 For boards tested in panel format, is the failed board identified before the panel is removed from the fixture?
对于多联板的印制板测试，在从夹具移走之前是否有对不合格板做标示？
7. Debug and FA Capability
1 Are boards awaiting debug identified and stored to one side of the operator or routed via dedicated conveyor?
等待修理的印制板是否标识和储存在操作者的一边或用专用的传送带？
2 Are debug buffer trigger points established to ensure process shut down should the limits be exceeded?
是否确定待测试板最多可以堆放的数量，以便当待测试板过多时可以停线处理。
3 Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
是否有证据表明修理和不良分析的技术员有资格认证或做正式训练吗？
4 Can it be demonstrated that all debug personnel meet the above requirements ?
是否有证据表明所有的修理人员符合上述要求吗？
5 Is there adequate debug equipment available at each debug station ?
每个修理岗位是否有足够的修理设备？
6 Is ICT debug and repair conducted real-time (on-line) whenever possible?
有可能的情况下，是否进行ICT实时(在线)修理？
7 Can it be demonstrated that a tool is used to capture fail codes, their fixes, and then recommend the most common fix?
是否有证据表明有一种工具/系统用于取得不良现象的代码和解决方案，并推荐常用的修理方法？
8 Does the ICT debug technician access the ICT system via a display unit to better understand to root cause of failure?
ICT修理人员是否通过显示设备查询ICT系统以便更好的理解导致不良的根源所在？
9 Is a test point location map available to the repair/failure analysis operator?
是否向维修/不良分析操作人员提供测试点分布图？
10 Are there detailed instructions on determining false failures?
是否有“如何判定是否是设备误判”的详细说明？
11 Are false failure rates tracked, monitored, and documented?
误判率是否跟踪，监控，和归档？
12 Are there goals for false failure reduction? (I.e. goals to increase FPY)
有减少误判的目标吗？（也就是提高一次通过率(FPY))
FnTest
1. Operator and Work Instructions:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Is there a revision controlled Test Instruction which contains unique details for the specific product being tested? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的作业指导书?（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are Work Instructions readily available to the test operator and are they followed?
操作者是否易于取得作业指导书并且确实遵照执行？
3 Is the Test File name and number specified on Work Instructions?
测试文件名和编号是否列于操作说明中？
4 Is the Test File traceable to a specific PCBA part number and revision level and to the Unit Under Test?
测试文件是否可以追溯到特定的PCBA物料编号与版本？
5 Does the test Operator have the Standard Operating Procedure (SOP) for the tester available to them at all times?
任何时候测试者均能取得测试仪的标准操作程序吗？
6 Is there evidence that the Operator been trained and certified against the Standard Operating Procedure for the Tester?
是否有证据可以证明操作者受过对测试仪的标准操作程序的训练并经过认定？
7 Does the Operator know the content of the Standard Operating Procedure for the Tester and do they and follow it?
操作者是否了解测试设备标准操作程序的内容并确实遵循执行？
8 Are Operators required to log in at the Test station and does this provide an automatic verification of training status?
是否有一个机制在作业员输入个人识别之后可自动核实其是否训练合格可以上岗。
2. Fn Test Fixture
Is the Test fixture identified with a name or number?
测试夹具是否标识名称或编号？
2 Is the Preventative Maintenance / Calibration sticker on the fixture current and up to date?
测试夹具的保养维护/校准标签是当前的最新的吗？
3 Is there a Preventative Maintenance procedure and schedule for each Test fixture?
是否有每个测试夹具的维护保养程序和进度表？
4 Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
是否有证据表明维护保养记录是最新的？
5 Are NDF rates used to flag a test station maintenance schedule?
NDF(无不良发现,No Defect Found)率是否用于标记测试岗位的维护进度？
6 Are there goals for NDF reduction specified for each product and each fixture?
是否针对每种产品和夹具确定减少NDF的目标？
7 Are spare parts for test stocked?
是否备有测试备用部件？
8 Is the inventory of spare test parts adequately controlled?
测试备用部件的详细库存目录是否得到充分控制？
3. Fn Test Software
1 Are all Fn Test systems networked to a server?
所有的功能测试系统都通过网络与服务器链接吗？
2 Is the Functional Test software downloaded from a central server when the program is called up and at least daily thereafter?
当程序启动时功能测试用的软件是否从一个中心服务器上下载并且至少每天核对一次？
3 Is the Fn Test software revision controlled for program changes?
程序变更时功能测试的软件是否做版本管控？
4 Is a control method used to log all changes to the Fn Test program and is it available?
是否有一种控制方法用于记录功能测试程序的所有更改，它确实有用吗？
4. Test Operation
1 Is there an automated method of loading test programs?
是否有自动装载测试程序的方法？
2 Is there a documented and agreed convention outlining the storage of untested, failed, and pass boards?
是否有文件规定待测试板，测试不良的板，和通过测试的板的储存？
3 Are boards marked in some way to facilitate the implementation of this convention? (Forced Routing is acceptable.)
印制板上是否有作某些标记以利于该规定的执行？（强制流程也可以）
4 Are boards awaiting test identified and stored separately according to the convention OR routed via a dedicated conveyor?
等待测试的印制板是否按照规定进行标识和分别储存，或者用专用的传输带？
5 Are passing boards identified and stored separately according to the convention OR routed via a dedicated conveyor?
通过测试的印制板是否按照规定进行标识和分别储存，或者用专用的传输带？
6 Are failing boards identified and stored separately according to the convention OR routed via a dedicated conveyor?
测试不良的印制板是否按照规定进行标识和分别储存，或者用专用的传输带？
7 Are pass and failed boards stored on different storage carts OR routed via a unique conveyor?
合格与不合格的印制板是否储存在不同的周转车或专用传输带？
8 Is SPC data collected and effectively used at this process point?
SPC数据是否收集并有效用在功能测试站？
9 Is the content of the SPC data chart up-to-date?
SPC数据图表的内容是否是最新的？
10 Are out of control SPC data points effectively actioned?
对超出SPC管制的点是否有采取有效措施？
11 Are Fn Test buffer trigger points established to ensure process shut down should the limits be exceeded?
是否确定待测试板最多可以堆放的数量，以便当待测试板过多时可以停线处理。
12 Has a Gauge R&R study been completed in accordance with Dell GR&R Procedures?
量测系统的重复性和重现性研究是否依据Dell的GR&R程序完成？
13 Is test coverage calculated based on the total number of functions and features versus those that are exercised? (See Dell Feature Summary)
测试覆盖率的计算是否基于测试的点数与总的测试数的比值？(参考DELL性能列表）
5. Fn Test WIP Tracking
1 Is a Forced Board Routing system and WIP Tacking system fully deployed throughout the test process?
一个强制的印制板流程系统和WIP定位系统是否在整个测试过程被充分运用？
2 Does the system verify the 'last' step processed and compare it to the expected 'last' step?
系统是否校验最后步骤并与预期的最后步骤进行比较？(是否上一个步骤有正确完成？）
3 Do boards that PASS have an identifying mark to indicate their pass status? (Forced Routing is acceptable.)
PASS板是否有识别标识以显示其合格通过的状态？（强制的行程安排也可接受的）
4 Do boards that FAIL have an identifying mark to indicate their fail status? (Forced Routing is acceptable.)
不合格的FAIL板是否有识别标识以显示其不合格状态？（强制的行程安排也可接受的）
5 Do failed boards have Fn fail details attached for debug purposes?
不合格的印制板是否附有不良项目的说明以便维修？
6 Do all debugged boards have an identifying mark to indicate a debug status? (Forced Routing is acceptable.)
所有的修理完的板是否都有识别标识以显示其修理状态？（强制的行程安排也可接受）
7 Is there a software link between Fn Test results & the Forced Routing/Quality Data System?
功能测试结果和强制流程/质量数据体系间是否有软件链接？
8 Does this software link eliminate manual intervention to indicate the test result status?
这种软件链接是否排除人工干涉测试结果状态的显示？
9 Is this link fully automated and used to log Test Yield/First Pass Yield & Board Yield data?
这种链接是否充分自动用于记录测试数量/一次合格数量/印制板产量数据？
10 Is FPY and BY readily known and has it been calculated in accordance with Dell definitions?
是否FPY(First pass yield)和BY(Board Yield)有被统计并且是依照DELL的定义计算的？
11 Can it be demonstrated that there are no boards in the debug analysis loop for longer than 30 days?
是否有证据表明没有印制板分析维修超过30天？
12 Can it be demonstrated that boards in the Fn Debug Loop have had their ICT Pass mark removed before being returned to ICT?
是否有证据表明处于功能维修阶段的印制板在重做ICT之前，板上以前的ICT合格标志有被去掉？
6. Debug and FA Capability
1 Are boards awaiting debug identified and stored to one side of the operator or routed via dedicated conveyor?
等待修理的印制板是否标识和储存在操作者的一边或用专用的传送带？
2 Are debug buffer trigger points established to ensure process shut down should the limits be exceeded?
是否确定待测试板最多可以堆放的数量，以便当待测试板过多时可以停线处理。
3 Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
是否有证据表明修理和不良分析的技术员有资格认证或做正式训练吗？
4 Can it be demonstrated that all debug personnel meet the above requirements ?
是否有证据表明所有的修理人员符合上述要求吗？
5 Is there adequate debug equipment available at each debug station ? E.g. Multimeter, oscilloscope, bus emulator, etc.
在每一个维修的岗位上是否已经有足够的维修设备？例如：万用表、示波器、Bus emulator(总线仿真器?)等
6 Can it be demonstrated that a tool is used to capture fail codes, their fixes, and then recommend the most common fix?
是否有证据表明有一种工具/系统用于取得不良现象的代码和their fixes，并列出常用的修理方法？
7 Are schematics for the latest revision of the board available?
是否有最新版本的电路图纸？
8 Has it been demonstrated that component replacement data is logged by board serial number?
是否有证据表明元件更换的数据有按印制板的序列号进行记录？
9 Is it clear which components have been replaced on each board in the repair/failure analysis area? (Use Shop Floor Data System)
印制板在维修/不良分析时哪些元件被换掉可以很清楚地追溯到？（使用流程管制系统Shopfloor system)
10 Has it been demonstrated that each board has a record showing the number of components replaced? (Use Shop Floor Data System)
是否有证据表明可以追溯到一块印制板有多少元件被换过？（使用流程管制系统Shopfloor system)
11 Is lot level traceability maintained for any critical components that have been replaced?
关键元件的更换记录是否可以追溯到批次？
12 Are there detailed instructions on determining false failures?
是否有“如何判定是否是设备误判”的详细说明？
13 Are false failure rates tracked, monitored, and documented?
误判的比率是否被跟踪，监视，和备案？
14 Are there goals for false failure reduction? (i.e. goals to increase FPY)
是否有制定减少误判的目标？（也就是提高FPY的目标）
General
General
1. Environmental and ESD Control:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Are there temperature & humidity sensors in the Manufacturing area to monitor temperature & humidity over time?
在生产区域是否有温度计、湿度计，以定时地测试温湿度？
2 Are there documented upper & lower specification limits for temperature and humidity to assure Paste viscosity, ESD & MSD control?
是否有规定温度和湿度的限度，以确保锡膏粘性、ESD、MSD控制？
3 Is there evidence to demonstrate that effective action was taken when the temperature/humidity was outside the defined limits?
是否有记录表明当温湿度超出限度时有采取有效的措施？
4 If AC Ground is used as Earth Ground for ESD purposes, is it clearly understood that AC Ground must be connected to a grounding rod?
如果电气设备接地也被用来作为ESD接地，则电气接地点要可靠的接到接地棒？
5 Is ESD Earth Ground impedance (grounding rod to earth) measured at least annually?
ESD接地棒对大地电阻是否至少每年测量一次？
6 Does the above measurement result comply with established specifications?
以上测量结果是否符合已制定的标准？
7 Is either an ESD Conductive or Static Dissipative floor installed in the Manufacturing areas? ESD Matting also scores 0, except for 7 thru 10.
是否有安装静电传导型或静电耗散型的地板安装在生产区域？
8 Is there evidence that the floor was installed using conductive adhesive with copper earth grounding straps?
是否用导电粘合剂和铜条来安装防静电地板？
9 Is there evidence that the floor is cleaned in accordance with the floor/coating manufacturer's specification?
是否有充分记录表明地板在按照制造商的标准清洁？
10 Are fixed material storage racks for components/assemblies earth grounded?
是否固定的存放原材和半成品的材料架有被良好接地？
11 Do portable material storage racks for components/assemblies use conductive wheels or drag chains to contact the ESD floor?
是否可移动的料架有用导电轮或拖地链条以和防静电地板良好接触？
12 Are all machines ESD Earth Grounded?
是否所有设备防静电接地良好？
13 Are timed Resistance-to-Ground tests conducted using an ESD Meter to periodically evaluate ESD performance?
是否有用仪表定时地测试对地电阻？
14 Is there evidence that at least five tests are taken per 5000 square feet of production floor space?
是否有记录表明至少每5000平方英尺(5000x0.093=464平方米）测量5点？
15 Is there evidence of periodic performance testing of the floor, fixtures, and all work and material storage surfaces in the ESD protective area?
是否有记录表明静电防护区内陆板、治具、工件、材料区有定期的ESD性能测试？
16 Are ESD protective areas appropriately marked and labeled?
静电防护区域是否有适当的标示？
17 Is there evidence that anyone in the ESD protective area is required to wear ESD Smocks and two ESD Shoe Straps/ESD Shoes? Note*
是否在静电防护区内的所有人员有被要求穿防静电工作服、防静电脚腕带或静电鞋？
18 Is there evidence that anyone seated must use a wired ESD strap while handling components in addition to Shoe Straps/ESD Shoes?
除了静电脚踝带/静电鞋，任何坐着工作的人员在接触元件时一定要戴有线静电环？
19 Is there evidence that the chairs used are ESD safe and are they in conductive contact with the floor?
是否工作椅是防静电的，并且和地板导通？
20 Is there evidence that Shoe Straps/ESD Shoes and wired wrist/ankle straps are tested each time ESD Protective items are garbed?
是否有记录表明静电防护用品（静电鞋/手环/脚踝带）在每次戴上前都有测量？
21 Is there evidence that the materials used in operator tools inside the ESD protective area ESD safe?
静电防护区内作业员所用工具的材料是否符合静电防护要求？
22 Is there evidence that Antistatic & Static dissipative material (usually pink) is not used outside the ESD area for component storage?
在静电防护区外，抗静电和静电耗散材料做的包装（通常是粉红色）没有用来存放元件？
23 Is there evidence that Static Shielded material (usually gray) is used outside the ESD area for component storage?
在静电防护区外，是用静电屏蔽材料做的包装（通常是灰色）来存放元件？
24 Is there evidence that periodic Static Audits are conducted to verity the ESD grounding system deployed in the ESD area?
是否有记录表明在静电防护区域内有定期的接地系统测量、稽核？
2. Line Set-Up and Control
1 Is a Forced Board Routing system and WIP Tracking system fully deployed throughout SMT, PTH and Test?
在整个SMT、PTH和测试过程中，强制流程管理系统和在制品跟踪系统是否有充分展开？
2 Are all boards tracked through the process by serial number and is board history available for traceability purposes?
所有的板是否通过系列号跟踪整个过程？为了达到“可追溯”目的，板的历史数据是否可得到？
3 Does the system verify the 'last' step processed and compare it to the expected 'last' step?
系统是否对过程中的最后步骤与期望的最后步骤进行比较验证？
4 Are quality performance or buffer trigger points established to ensure machine shut down should the limits be exceeded?
是否设立质控点或最大允许积板数，以保证当超过限制时机器停车？
5 Are line shutdown criteria clearly specified for both quality and buffer limiting requirements?
对于质量要求及最大允许积板数要求，在停线标准中有没有清楚地定义？
6 Is there a documented checklist available and in use to ensure successful product changeover?
有没有文件化的检查清单，并用来确保顺利地机种切换？
3. Machine Maintenance (Select any machine used in the PCBA Manf. process and answer all questions below base on selection)
1 Is there a recommended Spare Parts list for the selected machine?
对所选机器有没有推荐使用的备件清单？
2 Are on-hand stock quantities and minimum reorder points set and controlled using a database?
是否用数据库对库存的备用件和最低再请购数量进行设置并加以控制？
3 Does the on-hand stock balance reflect the physical stock quantities for two samples taken?
抽查两个零件，数据库中的备用件存量是否和实际库存量一致？
4 Are Daily Maintenance logs kept at the machine and are they up to date?
日常保养记录是否保存在机器旁，并且他们是最新的？
5 Is a Preventative Maintenance System used to flag when periodic Preventative Maintenance is required?
预防性保养系统能否用来指示什么时候需要定期的预防性保养？
6 Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
有没有证据证明预防性维护保养记录是最新的？
7 Are problem descriptions and their closure recorded and verified on the Daily and Preventative Maintenance logs?
问题描述及其结果是否都有记录并在日常及预防性维护保养记录中得以证实？
4. Machine Operator (Select any machine operator in the PCBA Manf. area and answer all questions below base on selection)
1 Does the Operator have the Standard Operating Procedure (SOP) for the machine available to them at all times?
操作者能否随时得到机器的标准作业程序（SOP）？
2 Are WIs & SOPs free of hand written updates? Temporary hand written updates are OK if signed and dated with expiration date <48 hrs.
作业指导书（WI）和标准作业程序（SOP）是否有手工更改内容？如果有不超过48小时且有签名及日期的临时手工更改的内容也可以接受。
3 Is there evidence that the Operator has been trained and certified against the Standard Operating Procedure for the Machine?
有没有证据表明操作者已经经过针对机器的标准作业程序的培训并取得资格？
4 Does the Operator know the content of the Standard Operating Procedure for the Machine and do they and follow it? (Score 1 if the operator has not memorized the contents, but can quickly reference the SOP to answer the auditors questions.)
操作者是否知道机器的标准作业程序的内容并遵照执行？（如果操作者不记得其内容，但能很快地根据标准作业程序回答审核员的问题得1分）
5 Are Operators required to log in at the Machine station and does this provide an automatic verification of training status?
是否有一个机制在作业员输入个人识别之后可自动核实其是否训练合格可以上岗。
5. PCBA Inspector (select any inspector in the PCBA Manufacturing area and answer all questions below base on selection)
1 Is the Inspector required to wear gloves or finger cots when handling boards and do they wear them?
当检验员拿板时是否要求其戴手套或指套，他们是否有戴？
2 Does the Inspector have the IPC-610 standard available to them at all times? (Score 1 if a copy of IPC 610 is available in the general area.)
检验员是否能随时取得IPC-610？（在现场能得到IPC-610的复印件可得1分）
3 Is there evidence that the Inspector has been trained and certified against the IPC-610 Standard and on component identification?
有没有证据证明检验员有得到过针对IPC-610标准及识别元器件的培训并取得资格？
4 Does the Inspector know the content of the IPC-610 Standard and are they able to read component identification markings?
检验员是否知道IPC-610标准的内容并且他们能识别元器件的识别标识？
5 Are Operators required to log in at the inspection station and does this provide an automatic verification of training status?
是否有一个机制在作业员输入个人识别之后可自动核实其是否训练合格可以上岗。
6 Do quality inspectors have access to sampling plans (e.g. ANSI, MIL, ASQ，AQL) at all times?
质量检验员能否随时取得抽样计划（如ANSI，MIL，ASQ，AQL）？
7 Does the quality inspector know the sampling plan and switching rules for increased/decreased sample sizes?
质量检验员是否知道抽样计划和当样本大小增加或减少时的转移规则？
8 Does quality inspector have access to product specific reference tools, (e.g. golden unit, templates)?
质量检验员是否能取得产品的特殊参考工具？（如golden unit,模板）
9 Is there evidence that quality inspector has been trained/certified in basic quality practices and statistics/SQC?
有没有证据证明质量检验员已得到关于基本质量知识和统计/统计质量控制（SQC）方面的培训并取得资格？
6. Chemical Compatibility
1 Is there a master matrix which outlines the Chemical Compatibility for solder wire, fluxes, flux pens, cleaning solutions, etc?
有没有一个概括化学品兼容性的主要矩阵？包括焊锡丝、助焊剂、助焊笔、清洁溶剂等。
2 Was a study conducted to assure the chemical compatibility of the consumables on the list and is it available?
有没有对清单上的消费品的化学兼容性进行研究？研究结果是否可得到？
3 Are specifications readily available for the various types of solder, flux, cleaning agents, etc. being used?
能否方便得到正在使用的各种类型的焊锡、助焊剂、清洁剂等的规格书？
4 Are Chemical Industry standard labeling used to identify all chemicals used, e.g. flux, alcohol, etc?
是否使用化工标准标签来识别所用的化学品？如助焊剂、酒精等。
7. Programmed Parts (Score NA if programming is subcontracted to a supplier)
1 Are revision controlled Work Instructions displayed for the operator at the programming station? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
在编程工作站操作者是否有一版本受控的作业指导书？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Are component part numbers and their descriptions specified on Work Instructions?
作业指导书上是否有元器件的部品编号和规格描述？
3 Are component descriptions sufficiently detailed to ensure the correct blank component is being used?
元器件的描述是否足够详细以确保正确的(未烧写的)元器件被使用？
4 Are label part numbers identified and a drawing/picture of the label contents included on the Work Instruction if labels are required?
如果需要标签时，作业指导书上是否有标签的识别编号和标签内容的图示？
5 Is the orientation of the label on the component consistent and does it include the correct checksum information if required?
标签方向是否和组件一致？当需要时是否包括了正确的校验码信息？
6 Are parts only labeled post programming with the program information if such info is required as per Dell's specification drawings?
如果DELL的规格图示要求要有这些信息时，是不是部件只是在烧写完成后才贴上包含程序信息标签？
7 Is there evidence to demonstrate that programmed parts are clearly segregated from unprogrammed parts?
有没有证据证明已烧写好的部件与未烧写的部件清楚地区分开？
8 Is the Master Program name/number and revision indicated on the Work Instructions and traceable to the current PCBA revision?
作业指导书上有没有标出主程序名/号和版本，并可以与当前PCBA版本对应？
9 Do Work Instructions indicate the orientation for loading blank components into the programmer?
作业指导书上有没有标示空白元件放入烧写器的方向？
10 Are the Moisture Sensitive Devices (MSDs) readily known to the operator?
操作者是否都能很快辩认出潮湿敏感元件？
11 Are MSDs time stamped at opening and their exposure time recorded as a result of programming?
潮湿敏感元件(MSD)拆封后有没有记录开封时间、暴露时间，并且和烧写的结果予以一起记录？
12 Can MSD control, according to J-STD-033C, be demonstrated for MSD devices that need programming?
MSD管制文件是否有按J-STD-033C要求对需要烧写的MSD元件进行控制？
13 Is the orientation of programmed parts in their packaging preserved before and after programming?
烧写前后已烧写元件包装时放置的方向是否不变？
14 Is there evidence that a defined process for non-conforming material such as damaged, failing or programmable parts is in operation?
有没有证据表明针对不合格材料如已损坏的、失效的可烧录器件的处理流程有被切实执行？
ReworkRepair
ReworkRepair
1. General Repair Capability:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Is the capability of each piece of rework equipment defined to ensure the correct equipment is used for the correct rework operation?
每件返工设备的修理能力是否定义以确保合适的返工设备用于正确返工操作?
2 Is the rework process and equipment used appropriate to meet established industry standards and Dell standards?
整个返工过程和使用设备是否符合行业标准和DELL标准?
3 Is the age, limit quantity, and ECO level of boards in a repair loop monitored?
是否在修理时有控制待修时间、待修数量和主板的工程变更版本(ECO)
4 Is there a tracking system in place to monitor and limit the number of Reworks conducted on any given unique board serial number?
是否有一个管制到任何一块板的唯一的系列号的跟踪系统用来监控和限制返工的号码？
5 Is there a demonstrated method in place to highlight differences between a board's ECO level and the current board's ECO level?
是否有一种有效的方法用于清楚快速地区分待修板的ECO版本和当前最新版本之间的差异？
6 Does this method flag the rework path necessary to bridge the ECO gap?
这种方法是否可以有效地告知返工步骤，以便将待修板ECO版本更新为合适的版本？
7 Is minimal shippable ECO information available and a reliable method in place to ensure it is kept current?
是否有最小化的能可靠传递的ECO信息保证所使用的是当前的信息？
8 Is there a reliable tool available to provide ASL details for each component reference designator for the current BOM revision?
是否有一个可靠的工具用来提供当前BOM的每个元件的合格供应商清单？
9 Is there a reliable method in place to ensure BOM information is kept current?
是否有一个可靠的方法用来确保BOM信息是最新版本的？
2. General Rework and Repair
1 Is rework conducted real time and on the production line except for rework requiring specialized equipment?
除非需要特别的返工设备，返工是否在生产线上实时进行？
2 Is there a documented Rework Standard Operating Procedure for board preparation, rework techniques, and post rework practices?
是否有文件化的返工标准作业程序来规范板的准备、返工技术和返工布置?
3 Are all reworks carried out to IPC 7711 & 7721 standards?
所有的返工是否贯彻IPC7711和7721标准？
4 Prior to replacing a passive device is the operator required to verify its value using multimeter and do they?
操作者在更换被动元件之前是否有要求用万用表测量数值？有在做么？
5 Is there a documented frequency for the calibration and maintenance of Soldering Irons? Score 1 if Self Calibrating (SC).
是否有文件化的烙铁校验和维护频率？（如果自我校验，该项目得1分）
6 Is Solder Iron calibration conducted for the combination of a specific handheld iron with a specific control box? Score 1 if SC.
烙铁校验是否根据固定的烙铁与烙铁控制盒搭配进行，如果可自我校验得1分。
7 Does the handheld iron in use correspond to the control box used as indicated by the calibration records? Score 1 if SC.
使用中的烙铁是否与校验时搭配的控制盒一致，可自我校验结果该项目得1分。
8 Is there evidence to demonstrate that Soldering Iron calibration and maintenance is adequate and that records are up-to-date?
是否有证据证明烙铁的校验和维护是足够和最新的？
9 Are the operating temperatures and tip sizes to be used for the different component types clearly defined?
用于不同类型元件的烙铁是否有规定温度和烙铁头的尺寸？
10 Are all Soldering Irons in use grounded?
所有烙铁是否有接地？
11 Are rework consumables, i.e. Solder Wire, Flux, Cleaning agents, conditions of use documented?
返工所用的耗材，如焊锡丝，助焊剂，清洁剂是否按文件要求使用？
12 Are components required for rework stored a manner as to prevent damage prior to use?
用于返工的元件在使用前是否以合适的方式储存以防止损坏？
13 Does the reworker have access to visual aids/tools which will identify the value, location & polarity of components to be replaced ?
返工者是否使用可视辅助工具用于识别将要更换元件的数值，位置，极性？（例如放大镜）
14 Are the MSD devices being used in the replacement process stored and used according to their moisture level sensitivity rating?
在更换过程中，MSD元件是否按照其潮湿敏感等级使用、存放？
15 Is there evidence to demonstrate that the control process in use for MSDs is effective and complies with J-STD-033C?
是否有证据证明使用MSD的控制过程是有效的且遵守J-STD-033C?
16 Is there evidence that a board must be slow baked prior to MSD removal for when an MSD component is needed for failure analysis?
当一个MSD元件需要做失效分析时，是否有证据表明在拆卸MSD之前板子有经过慢速烘烤？
17 Is the bake procedure compliant with JEDEC standard J-STD-033C?
烘烤过程是否符合JEDEC标准J-STD-033C？
18 Is there evidence that the date code/lot code, part number and source of failed ICs is recorded for future failure analysis?
是否有证据证明失效IC的日期码/批码，料号，来源有记录以用于失效分析？
19 Is there evidence that the date code/lot code, of the replacement IC is recorded against the board serial number for traceability?
是否有证据证明更换IC的日期码/批码有针对板的系列号做记录以便跟踪？
3. BGA Rework
1 Are all BGA devices replaced using dedicated BGA Replacement Equipment with bottom side board heating and split prism alignment?
所有的BGA芯片更换是否用专用的，具备底面加热和裂相对准功能的BGA返工工作站？
2 Is there a documented Standard Operating Procedure for the setup and operation of BGA Replacement Equipment? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
是否有文件化的标准操作流程用于设定和操作BGA返工工作站（（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分））
3 Does the procedure specify the program name, nozzle & nest to be used for each type of BGA component?
该流程是否指定程序名，吸嘴和用于每一种型号BGA的整套器具？
4 Are specific removal and replacement reflow profiles available for each type of BGA component based on package type or part number?
规定的拆除和重装温度曲线是否适用于每一种型号BGA器件？该规定是否基于封装形式或料号？
5 Is there a revision controlled Operator Work Instruction for site preparation (cleaning PWB pads, application of flux/paste, etc.)? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
是否有版本受控的作业指导书用于现场准备（清洁PWB焊盘，涂敷助焊剂/锡膏等）（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
6 Is there a consistent & repeatable process for the application of flux &/or paste to the PWB or new BGA, defined in the Work Instruction?
对于在PWB或新BGA上涂敷助焊剂和/或锡膏，作业指导书中是否有规定一个稳定的可重复的过程？
7 Are all materials required for the application process listed in the Work Instruction and in a good state of repair? (This includes fixtures, micro-stencils, tools, consumables, etc.)
作业指导书中是否列出在维修过程所用到的材料且在良好的使用状态？（包括夹具，小钢网，工具和其他耗材）
8 Is alignment of the micro-stencil to the PWB/BGA accomplished via automated methods or fixturing? Score 0 if only manual visual alignment is used.
小钢网和PWB/BGA之间的对准是否通过使用自动方式的夹具？如果只用人工目视对准，该项目0分。
9 Is micro-stencil print quality inspected after printing? Sample inspection allowed if DOE and post re-work test results support sampling.
小钢网的印刷质量是否在印刷后做100%检查？如果DOE和返工后测试结果支持取样，则可采用抽样检查。
10 Are flux/paste usage conditions (cold storage, thaw time, expiration, etc.) know and followed? (Reference 'Paste Worksheet' section 2)
是否知道并遵守助焊剂/锡膏使用条件（冷藏，回温时间，过期时间等）？（参考“锡膏”第二部分）
11 Has it been verified that the Flux/Paste used is compatible with the original solder paste used during the manufacturing process?
是否能证明使用的助焊剂/锡膏能和原来生产中使用的锡膏兼容？
12 Is the removed BGA isolated from good product and dispositioned correctly?
拆下来的BGA是否和好的产品分开存放并处置正确？
13 Post BGA Rework, is the replaced BGA X-Rayed to verify replacement quality and to provide timely feedback on success or failure?
BGA返工后是否用X光检查更换质量并及时反馈？
14 Is there evidence that the date code/lot code, part number and source of failed BGA is recorded for future failure analysis?
是否有证据证明有记录失效BGA的日期码/批码，料号，来源以便将来失效分析？
15 Is there evidence that the date code/lot code, of the replacement BGA is recorded against the board serial number for traceability?
是否有证据证明更换BGA的日期码/批码有针对板的系列号做记录以便跟踪？
4. Mini-Wave Rework
1 Is there a documented Standard Operating Procedure for the setup and operation of Mini-Wave Equipment ? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
小锡炉有没有版本受控的标准作业指导书。
2 Does the procedure specify the solder type, its temperature setting, and the flux type to be used ?
作业指导书有没有定义要用的焊锡型号，温度设定，助焊剂的型号？
3 Does the procedure specify the nozzle for specific component type & the solder exclusion pallet to be used for each board?
作业指导书有没有定义对要换的元件相配套的喷嘴型号，和每种板用的避锡托架治具。
4 Has it been verified that the solder and other consumables are compatible with the original materials used during manufacturing?
是否有核实维修时用的焊锡和耗材与量产时用的是相容的。
5 Can it be demonstrated that solder exclusion pallets are used exclusively to minimize heat exposure to the rest of the board?
是否有证据表明有使用避锡托架以避免对板上其它元件的热冲击。
6 Has the use of Kapton tape been minimized/reduced due to the use of solder exclusion pallets?
使用避锡托架后有将Kapton tape(避热胶带）的使用量减到最少。
7 Does the Mini-Wave set-up allow the operator to use both hands to replace the component?
是否小锡炉的结构允许作业员用双手来替换元件。
8 Are components being used in the replacement process identified and stored correctly?
维修过程中用的元件是否正确标示和储存？
9 Are the components being used in the replacement process stored in their original packaging up to the point of use?
维修过程中用的元件在使用前也一直保存在原包装中？
10 Is the removed component isolated from good product and dispositioned correctly?
换下来的不良元件有和好的元件隔绝，并且处置正确。
11 Does the procedure specify the process and chemicals to be used for excess flux residue removal?
作业指导书是否有定义去除多余助焊剂的步骤和化学用品。
5. Post Rework and Repair Inspection and Feedback（返工和修理后的检查和反馈）
1 Are magnification & lighting tools available at the inspection station? Magnification must be as per IPC based on component type.
检验站是否有合适的放大和照明工具？放大倍数必须对应IPC规定的元件类型?
2 Are repaired boards 100% inspected post repair not only for the repair undertaken but for possible repair damage?
修理后的板是否100%检查？不仅检查修理过的部位，同时还需检查可能因修理而发生的损坏?
3 Is it documented that boards repaired in the offline repair area be processed through all possible test steps (AOI, AXI, ICT, FCT/FVS, QT, etc.)?
是否有文件规定离线修理的板要重新经过所有可能的测试步骤？（AOI，AXI，ICT，FCT/FVS, QT,等）
4 Is the data collected meaningful and can it be demonstrated that it is used to make process control/improvement decisions?
数据收集是否有意义？能否证明用于过程控制/改进决策？
5 Is the rework conducted traceable to a specific rework operator?
是否能追踪到返工操作者？
6 Is there evidence that operators receive timely feedback related to the quality of their work?
是否有证据证明操作者能及时接收到有关于他工作质量的反馈？
7 Are rework quality goals tracked on a by-operator basis with trigger limits set for re-training/re-assignment if quality goals are not met?
返工品质目标是否按操作者跟踪？如果未能达到品质目标，是否重新培训和委派？
8 Are reworked or forced re-worked boards run through PCBA reliability testing at least on an annual basis? (This may include cross sectioning, 3D x-ray, HALT/HASS, etc.)
返工板是否至少每年一次做PCBA可靠性测试？（包括切片实验，三维X光，加速寿命实验/HASS等）
9 Is there evidence that the board has been appropriated cleaned post rework?
是否能证明返工后的板有经过适当的清洁？
RMAProcess
RMAProcess
1. RMA WIP Flow and Tracking:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Are Dell Returns logged into the RMA tracking system by serial number upon receipt?
Dell退回品是否通过单据上的系列号记录在RMA跟踪系统中？
2 Are all failure details supplied by Dell entered into the tracking system for each board serial number? (e.g. RTV & DSP details.)
Dell提供的所有失效情况是否按每块板的系列号进入跟踪系统？（如RTV和DSP情况）
3 Does the tracking system have the proven capability to segregate factory returns from field returns using forced routing?
跟踪系统有没有证明其有能力用强制流程将市场返回品和工厂返回品区分开来？
4 Does the tracking system have the proven capability to capture a specific serial number that has been flagged by Dell Engineering ?
跟踪系统是否有能力可以将一个被Dell工程部门指定系列号找出来？
5 Does the tracking system have the proven capability to record Warranty & ECO status on Dell Returns?
跟踪系统有没有证明其有能力记录Dell返回品的保修期及工程变更状态？
6 Does the tracking system have the proven capability to report both the manufacturing history & previous RMA history by serial number?
跟踪系统有没有证明其有能力根据序列号列出制造时的经历记录和以前的RMA经历记录？
7 Does the tracking system have the proven capability to identify the receipt of 2nd or 3rd time Dell Returns?
跟踪系统有没有证明其有能力识别Dell是第二次或第三次退回？
8 Does the tracking system include a flag to identify when Dell Returns should be scrapped? (Dell Requirement is to scrap upon 3rd time return)
跟踪系统是否包括一种标识以识别Dell返回品是否达到必须报废的次数？（Dell要求退货三次以上必须报废）
9 Does the tracking system have the proven capability to monitor the turn around time by board serial number and to conduct full WIP age analysis?
跟踪系统有没有证明其有能力通过板的系列号来监控周转时间和指导在制品的老化分析？
10 Can it be demonstrated that there are no boards in the RMA loop for longer than 30 days?
能不能证明没有板的RMA维修期超过30天？
11 Does the tracking system have the proven capability to capture repair and defect information for every board serial number?
跟踪系统有没有证明其有能力根据每块板的系列号来找出其维修和不良信息？
12 Does the tracking system have the proven capability to capture and highlight the lot code of critical components replaced as a result of rework?
跟踪系统有没有证明其有能力找出维修后替换的关键元件的批号？
13 Does the tracking system have the proven capability to allow traceability between the reworked board and the reworker who completed the rework?
跟踪系统有没有证明其有能力追溯到返工的板和相应的维修的作业员？
14 Does the tracking system have the proven capability to provide an analysis Report for boards undergoing RMA and boards completed RMA?
跟踪系统有没有证明其有能力提供正在进行RMA的板及已完成RMA的板的分析报告？
15 Is a Forced Board Routing system and WIP Tacking system fully deployed to monitor and control RMA Process Flows?
强制产品流向系统和在制品跟踪系统是否完全开展以监督和控制RMA流程？
16 Does the system verify the 'last' step processed and compare it to the expected 'last' step? (True Forced Routing)
系统是否校验最后步骤并与预期的最后步骤进行比较？(是否板子有流过每个工位，没有步骤被跳过）
17 Does the forced routing system have the proven capability to automatically re-route NFF boards for additional special processing?
强制产品流向系统有没有证明其有能力自动调整NFF(No Fault Found，无不良发现)板的路线来进行额外的测试？
18 Has it been demonstrated that RMA pass/fail data is logged real-time to the forced routing system by serial number and is available?
是否有证据表明RMA合格/不合格数据在强制产品流向系统中按照系列号进行实时记录？
19 Does the system ensure that only boards that have passed through all stages of the RMA Process will be returned to Dell?
系统能否保证只有通过了RMA所有过程的板才能返还给Dell?
20 Does the layout of the RMA area indicate that it has been process engineered to avoid product mixing?
RMA区域划分是否经过程规划以避免产品混在一起？
2. Process for Failure Verification
1 Are there available revision controlled RMA Process Flow Charts for processing Dell Field and Line Returns? (Score 0 if any unsigned/undated handwritten modifications more than 48 hrs old)
对Dell市场和生产线退回品是否有一版本受控的RMA维修流程图？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Does the Process Flow indicate that all Dell Returns are fully inspected for workmanship issues prior to test processing?
维修流程是否显示所有Dell退回品在检测前有全部检验是否有作业不良问题？
3 Does the Process Flow indicate that all Dell Returns are fully inspected for damage prior to test processing?
维修流程是否显示所有Dell退回品在检测前经全部检查是否有损坏情况？
4 Does the Process Flow indicate that all Dell Returns are reviewed for ECO status prior to test processing?
维修流程是否显示所有Dell退回品在检测前审核其工程变更状况（适用的版本）？
5 If workmanship or damage is detected, does the Process Flow require details to be recorded in the RMA tracking system prior to repair?
如果发现有作业不良或损坏，维修流程是否要求维修前在RMA跟踪系统中记录详细情况？
6 If workmanship or damage is detected, does the Process Flow require product to be HMUed for failure mode verification prior to repair?
如果发现有作业不良或损坏，维修流程是否要求产品在维修前先用HMU对不良现象进行确认？
7 Does the Process Flow indicate that workmanship or damage should only be repaired post HMU failure verification?
维修流程是否表明作业不良或损坏只有在HMU检验后才能进行修理？
8 Does the Process Flow indicate that ECO upgrade should only take place post HMU failure verification?
维修流程是否规定工程变更升级只有在HMU检验后才能进行？
9 Does the Process Flow indicate that Dell Returns must not be upflashed at HMU verification without first determining if the original flash was corrupted?
维修流程是否规定Dell退回品如果原始的Flash损坏，在没有HMU检验前不能更新。
10 Does the Process Flow require that the top components on the failure Pareto be captured and preserved for Component Analysis? (These components must represent either the top 5 failures or the top 80% of failures)
维修流程是否要求在不良品柏拉图中占比例最高的元件应找出来并留作元件分析用？（这些元件必须代表最高的五种失效品或占80%的失效品）
11 Are the top component replacements verified on a socketed board before they are returned to the supplier for Failure Analysis ?
退回供应商作失效分析前这些失效率高的不良元件是否在一个带插座的板上验证过？
12 Does the Process Flow indicate that repaired boards are processed through all applicable testing (ICT, Functional Test, HMU, AOI, AXI, etc.) prior to shipping?
维修流程能否表明那些经维修过的板在发运前有经过了所有要求的测试（ICT，功能测试，HMU，AOI，AXI等）
13 Does the Process Flow ensure that all boards to be shipped to Dell are reflashed to the correct revision of Bios, Firmware, CMOS, etc?
维修流程能否保证所有运回Dell的板均已更新的正确版本的BIOS，固件，CMOS等？
14 Does the Process Flow ensure that all board repairs correlate to the reported failing symptom prior to shipping? Also score 1 if uncorrelated boards are routed for special CND/NDF processing.
维修流程是否规定 在发运前是否所有维修情况有核对最初报告的不良现象是否修好? 如果没有核对但是有做CND/NDF流程也可以得1分。
15 Can it be demonstrated that RMA data is used to improve Production Processes?
能否证明RMA数据有用来改进生产过程？
3. Control of No Defect Found (NDF)
1 Does Process Flow indicate how No Defect Found (NDF) boards are processed on completion of the failure verification process?
维修流程是否说明“无不良发现”(NDF)板是如何进行不良现象确认？
2 Is there a documented procedure which defines an NDF and the process for handling and processing NDFs?
有没有文件化的程序来定义什么叫NDF，如何处理NDF？
3 Is the percentage of NDFs less than 5% of total for Dell Line Returns due to on-site failure verification at Dell factories? Score NA if no OSV.
在DELL工厂现场不良确认数据中，Dell生产线所有不良中NDF是否小于5%。如果没有现场不良确认(OSV)记N/A
4 Can it be demonstrated that the supplier utilizes additional 'special processes' in an attempt to 'force' an NDF to fail?
是否有证据表明供应商有用“特别测试程序”来发现“无不良发现”板中的不良?
5 Do these additional special processes include such processes as 'Burn-in Test', or 'Extended Test', or 'Configuration Tests', etc?
额外的特别过程是否包括以下过程，如老化试验，Extended Test，或Configuration Test等？
6 Can it be demonstrated that the supplier utilizes configuration matching in an attempt to 'force' an NDF to fail for a specific config?
是否有证据表明供应商有用不同配置匹配来发现只有在特殊配置下才能发现的不良。
7 Can it be demonstrated for Dell Line Return boards, that NDFs that continue to pass all tests and special processes are held for Test Correlation? Note*
能不能证明Dell生产线退回的板中仍然能通过所有检测和特别测试的那些NDF板有被留下进行相关测试？
8 Is it documented that a Test Correlation exercise must be conducted between RMA Test and Dell factory Test for Dell Line Returns?
文件上有没有规定对Dell生产线退回品必须进行RMA和DELL工厂之间测试的差异性检查？
9 Is there evidence available to demonstrate that Test Correlation exercises are conducted at least every 6 months?
是否有证据表明测试差异性检查至少每6个月进行一次？
10 Can it be demonstrated that Test Correlation data is used to improve Test Coverage?
能否证明测试差异性数据有被用来提高测试覆盖率？
4. Debug and FA Capability
1 Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
是否有证据表明修理和不良分析的技术员有资格认证或做正式训练吗？
2 Can it be demonstrated that all debug personnel meet the above requirements ?
是否能证明所有的维修人员满足上诉要求？
3 Is there adequate debug equipment available at each debug station ?
在每一个调试站是否有足够的维修工具/设备？
4 Is a mulitmeter available at each debug station?
每个维修站是否有万用表？
5 Is an oscilloscope available in each debug area?
每个维修站是否有示波器？
6 Is a bus emulator tool available, like Antron, in each debug area?
在每个维修工位，有没有 象Antron这样的 总线仿真器(Bus Emulator) 工具？
7 Can it be demonstrated that all debug personnel can demonstrate the use of all debug equipment ?
是否每个维修工都可以熟练使用维修设备？
8 Can it be demonstrated that a tool is used to capture fail codes, their fixes, and then recommend the most common fix?
是否有证据表明有一种工具/系统用于取得不良现象的代码和their fixes，并列出常用的修理方法？
9 Can it be demonstrated that the Test Software used to verify the fail at HMU is current to that which is used in Production?
是否有证据表明HMU用来测试的软件和生产时用的测试软件是一致的。
10 Can it be demonstrated that the Test Software used during Debug is current to that which is used in Production?
是否有证据表明Debug用的测试软件和生产时用的软件是一致的。
11 Are adequate Spare Parts stocked of all Test Equipment ?
所有的测试设备是否有足够的备件储备？
12 Is there evidence that rework operators receive feedback on the quality of the rework performed?
是否有证据表明维修工有收到维修质量的反馈。
5. PCBA Documentation
1 Are the latest schematics for the PCBA available at each debug/failure analysis station?
在每个维修/不良分析工作站是否有最新的电路图？
2 Do debug personnel have access to all down-rev revisions of schematics ?
维修人员能否取得所有版本的电路图？
3 Are all schematics available to all debug personnel?
所有的维修人员是否都可以得到所有的电路图？
4 Are the latest Bill of Materials and AVL for the PCBA available at each debug/failure analysis station?
在每个维修/不良分析工作站是否有最新的材料清单和PCBA的合格供应商名单？
Packing
Packing
1. Board Packing:Enter 1 or 0. NA may be a valid response for shaded cells.^
1 Is there a revision controlled Operator Work Instruction which contains packing information for the specific product being packed? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于指定产品是否有一版本受控的作业指导书包括正在包装的产品的包装信息？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Is the part number for the box (and inserts), etc. indicated on the Work Instructions? (Note: This includes single-pack boxes when applicable)
作业指导书上有没有标明包装箱（和衬垫）的物料编号？（注：包括单件包装箱）
3 Is the part number and dimensions for the static bag indicated on the Work Instructions?
作业指导书上是否标明静电袋的物料编号和尺寸？
4 Is the part number and location for all box labels to be attached defined?
包装箱的所有贴纸的物料编号和粘贴位置是否确定？
5 Are any board 'Handling/Packing Sensitive' areas highlighted on the work instruction? Parts which protrude or elevated parts are most sensitive.
作业指导书中是否醒目标出板子上需要“小心拿取/包装”的位置？突出的或高架的部件要特别小心。
6 Is every PCBA scanned prior to packing to ensure it has completed all process and test steps in the correct sequence? Note*
包装前是否有对每一PCBA进行扫描条形码以保证所有的程序和检验步骤都已按正确的次序完成？
7 Is there a significant automatic alarm raised if a board scanned at packing is not ready for shipment? Note*
如果包装扫描条形码时发现一块板不适合出货，会不会自动报警？
8 Has the orientation of loading the PCBA into the static bag and the box been defined?
PCBA装入静电袋和箱的方向有没有规定？
9 Is the method of folding and/or sealing the static bag defined once the PCBA has been inserted?
板子放入后，静电袋折叠和/或封口的方法有没有定义?
10 Is every PCBA scanned, placed in the static bag, placed in the box, in that sequence, before beginning to pack another PCBA? Note*
在开始包装下一个PCBA之前，是否每一块PCBA都按照扫描条形码，放入静电袋，放到包装箱内的流程？
11 Does the scanning operation verify through a forced routing system that all routed operations have been competed? Note*扫描条形码能否通过强制的系统来证实所有的作业内容都已完成？
12 Is the Dell Shipping label (or product ID) attached to the box before the box is sealed?
DELL的发运标签（或产品ID）是否是在封箱前贴好？
13 Do the labels and packaging requirements comply with the current Dell Packaging Specification requirements?
所有的标签和包装要求是否符合DELL当前的包装规格要求？
2. Palletization
1 Is there a revision controlled Operator Work Instruction for box stacking on the pallet? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
对于如何在栈板上堆放包装箱是否有一版本受控的作业指导书？（如果有没签名/没日期的手写说明或手写说明超过48小时该项目得0分）
2 Is the pallet type and dimensions indicated on the Work Instructions?
作业指导书中是否标明栈板的型号和尺寸？
3 Does the instruction require boxes to be cross weaved for stability, unless otherwise approved by Dell?
除非经过DELL的同意，为了包装箱堆放平稳，指导书上是否要求交叉摆放？
4 Does this instruction require the outer box label for each box to be visible for every box on the pallet?
作业指导书上是否要求栈板上每个箱子外面的标签看得见？
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